Toward a New Generation of Additively Manufactured Heat Exchange Technologies

这项发现研究计划的愿景是利用高性能聚合物复合材料（pc）和增材制造（AM）的最新科学和技术进步，开发新一代传热技术。这将使一种全新的轻量化、高性能的两相热虹吸管、热管和热交换器的创造和优化成为可能。***在传热应用中，增材制造与pc的结合提供了一个令人兴奋的机会，可以充分利用高导电性pc提供的卓越材料特性和增材制造提供的独特制造可能性。然而，在这些新材料和制造方法的发展与对其相关热物理的基本理解之间存在着明显的差距。***该计划的长期目标是对增材制造的聚合物复合材料（AM-PC）固体和结构中的热传输机制有一个基本的了解。未来5年的短期目标是：***1。表征AM-PC结构的有效导热性，并建立预测其机械和热行为的理论模型。* * * 2。了解和控制AM-PC表面几何形状的特征，以预测和减轻热接触电阻，并了解AM-PC在两相换热器中使用时的工作流体-表面相互作用。表征AM- pc表面的沸腾传热，并开发预测模型，以及AM提供的材料和制造可能性特有的新型沸腾增强技术。***该研究项目将是多学科的，将结合热流体科学，材料表征和热传递应用的AM。它将产生与am - pc相关的重要传热机制和现象的全面理解，并有助于开发新一代紧凑，高性能和轻质的热传输，交换和转换技术，以满足加拿大工业，如汽车，航空航天，电信和移动设备的需求。对于这些行业，必须在所有部件（包括热交换器）的严格重量限制下实现热目标。轻质，两相AM-PC热交换器提供了一个创新的解决方案，以一个极其紧迫的问题。***该项目还将培训和发展加拿大高科技产业急需的高素质人才（HQP）。

The vision for this Discovery Research Program is to enable the development of a new generation of heat transfer technologies which leverages the recent scientific and technical advances in both high-performance polymer composites (PCs) and additive manufacturing (AM). This will enable the creation and optimization of an entirely new class of lightweight, high performance, two-phase thermosyphons, heat pipes, and heat exchangers. *** The combination of AM with PCs for heat transfer applications presents an exciting opportunity to leverage the potential of both the exceptional material properties offered by high conductivity PCs and the unique fabrication possibilities offered by AM. However, there is a distinct gap between the development of these new materials and fabrication methods and a fundamental understanding of their associated thermal physics.*** This program's long-term goal is to develop a fundamental understanding of thermal transport mechanisms in and on additively manufactured polymer composite (AM-PC) solids and structures. The short-term objectives that will be addressed in the next 5 years are:***1. To characterize the effective thermal conductivity of AM-PC structures and to develop theoretical models for predicting their mechanical and thermal behaviour. ***2. To understand and control the characteristics of AM-PC surface geometries for the prediction and mitigation of thermal contact resistance and to understand working fluid-surface interactions between AM-PCs as they pertain to their use in two-phase heat exchangers.***3. To characterize boiling heat transfer on AM-PC surfaces and develop predictive models along with novel boiling enhancement techniques that are unique to the materials and fabrication possibilities afforded by AM. *** This research program will be multidisciplinary and will combine thermal fluid sciences, materials characterization, and AM for heat transfer applications. It will yield a comprehensive understanding of the important heat transfer mechanisms and phenomena associated with AM-PCs and help enable the development of a new generation of compact, high-performance, and lightweight heat transport, exchange, and conversion technologies to meet the needs of Canadian industries such as automotive, aerospace, telecoms, and mobile devices. For these industries, thermal targets must be achieved with severe weight constraints on all parts, including heat exchangers. Lightweight, two-phase AM-PC heat exchangers offer an innovative solution to an extremely pressing problem.*** This program will also train and develop much-needed highly qualified personnel (HQP) for Canada's high-tech industries.