Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
批准号:
RGPIN-2016-04807
负责人:
Wong, William
金额:
$3.13万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2020
资助国家:
加拿大
项目状态:
已结题
起止时间:
2020-01-01 至 2021-12-31
中文摘要
目前价值160亿美元的柔性电子市场正以14.5%的年增长率增长,预计2024年将达到670亿美元。与这项技术相关的研究和开发活动是滑铁卢大学(UW)在过去十年中开展的一项工作的重点,在此期间,研究人员在该领域做出了重大贡献。该计划将进一步扩大这些努力,创造机会引领这一快速崛起的技术集群,并使下一代灵活的纳米技术在大面积电子产品中得到广泛应用。
该计划的目标是开发新的和传统的加工技术,并将其与纳米材料相结合,为柔性电子产品创造功能增强的设备。该计划将研究三维(3-D)纳米线与二维(2-D)电子材料的结合使用,以开发利用机械弯曲来增强电子系统功能的纳米电子学。
在一个焦点中,纳米线与塑料的集成将利用纳米线在机械弯曲过程中从表面突出的移动。随着纳米线之间的距离越来越近,纳米线内部的光吸收就会增强。这种效应可以用在基于纳米线的太阳能电池和传感器中,以提高电池效率或制造高灵敏度的光学传感器。第二项研究将探索弯曲对低维过渡金属二卤化物的影响,以创造高性能的电子产品,同时也具有机械容错能力。
3-D传感器和2-D电子学的结合将带来功能增强的传感器系统。该计划将展示一种用于共形传感器阵列的集成技术。现有的成像技术,如数码相机,在平板传感器前安装了一系列光学元件,以最大限度地减少捕获图像的失真。柔性阵列可以符合更多功能的形状,例如眼睛的形状,允许使用简单的光学装置的低失真和更高的灵敏度。
该计划将影响太阳能、平板显示器和医疗成像行业,并将对高性能、机械坚固和节能的便携式电子设备的新兴应用产生长期影响。每个研究组件还可以用于各种应用,从而使技术能够轻松传播到行业。学生将接触到的一系列技术领域将为他们提供纳米技术领域的深入培训;这种培训将使他们能够开展未来的研究活动,以影响整个领域,并使他们对这项技术将如何影响和影响新兴的商业应用有一个基本的了解。
英文摘要
The current $16B flexible electronics market is growing at an annual rate of 14.5% and is predicted to reach $67B in 2024. Research and development activities related to this technology have been a focus of work conducted at the University Of Waterloo (UW) over the past decade, during which time researchers have made significant contributions to the field. This program will further expand these efforts to create opportunities to lead this rapidly emerging technology cluster and enable the next generation of flexible nanotechnology for a wide range of applications in large-area electronics.
The goals of this program are to develop and combine novel and conventional processing techniques with nano-materials to create functionally enhanced devices for flexible electronics. The program will investigate the use of three-dimensional (3-D) nanowires in tandem with two-dimensional (2-D) electronic materials to develop nanoelectronics that will take advantage of mechanical bending to enhance the functionality of the electronic system.
In one focus, the integration of nanowires onto plastic will take advantage of the movement of nanowires protruding from the surface during mechanical bending. As the nanowires move closer together the optical absorption of light within the nanowires is enhanced. This effect can be exploited in nanowire-based solar cells and sensors for enhancing cell efficiency or creating optical sensors with high sensitivity. A second study will explore the effect of bending on low-dimensional transition metal dichalcogenides to create high-performance electronics that are also mechanically forgiving.
The combination of the 3-D sensors and 2-D electronics will lead to functionally enhanced sensor systems. The program will demonstrate an integrated technology for conformal sensor arrays. Existing imaging technology, such as digital cameras, have a series of optics in front of a flat sensor to minimize distortion of the captured image. A flexible array can conform to a more functional shape, such as the form of an eye, allowing low distortion and higher sensitivity using simple optics.
The program will impact the solar energy, flat-panel display, and medical imaging industry, and will have a long-term influence on emerging applications for high-performance, mechanically robust, and energy-efficient portable electronic devices. Each of the research components can also be used for a variety of applications, permitting easy dissemination of technology to industry. The range of technical areas to which students will be exposed will provide them with in-depth training in the field of nanotechnology; this training will allow them to conduct future research activities to impact the field as a whole, and to provide to them a fundamental understanding of how this technology will influence and impact emerging commercial applications.
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Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
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批准号:RGPIN-2016-04807
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项目类别:Discovery Grants Program - Individual
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资助金额:$3.13万
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负责人:Wong, William
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批准号:544496-2019
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批准号:531185-2018
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财政年份:2019
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负责人:Wong, William
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Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
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批准号:RGPIN-2016-04807
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项目类别:Discovery Grants Program - Individual
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资助金额:$3.13万
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财政年份:2019
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负责人:Wong, William
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依托单位:
Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
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批准号:RGPIN-2016-04807
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项目类别:Discovery Grants Program - Individual
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资助金额:$3.13万
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负责人:Wong, William
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依托单位:
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批准号:526229-2018
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项目类别:University Undergraduate Student Research Awards
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资助金额:$0.33万
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财政年份:2018
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依托单位:
Metabolic engineering of E.coli for the production of the drug
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批准号:525776-2018
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项目类别:University Undergraduate Student Research Awards
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资助金额:$0.33万
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财政年份:2018
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负责人:Wong, William
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依托单位:
Thin-film transistor backplane array design and development for micro-LED displays****
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批准号:531185-2018
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项目类别:Collaborative Research and Development Grants
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资助金额:$3.64万
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财政年份:2018
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负责人:Wong, William
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依托单位:
Nanoparticle-functionalized TFTs for biosensing in disease monitoring applications
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批准号:522428-2017
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资助金额:$1.82万
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财政年份:2017
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负责人:Wong, William
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依托单位:
Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
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批准号:RGPIN-2016-04807
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项目类别:Discovery Grants Program - Individual
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资助金额:$3.13万
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财政年份:2017
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负责人:Wong, William
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依托单位:
Advanced carbon-based electrodes for large-area flexible electronics
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批准号:501120-2016
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项目类别:Engage Grants Program
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资助金额:$1.82万
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财政年份:2016
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负责人:Wong, William
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Heterogeneous Integration and Mechanical Manipulation of Flexible Nanoelectronic Devices
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批准号:RGPIN-2016-04807
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项目类别:Discovery Grants Program - Individual
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资助金额:$3.13万
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财政年份:2016
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依托单位:
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批准号:463397-2014
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项目类别:Strategic Projects - Group
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资助金额:$14.19万
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财政年份:2015
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批准号:452421-2013
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