Graph-Based Redundant Via Insertion and Guiding Template Assignment for DSA-MP
Graph-Based Redundant Via Insertion and Guiding Template Assignment for DSA-MP
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DSA-MP 基于图形的冗余过孔插入和指导模板分配
DOI:
10.1109/tvlsi.2018.2850044
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发表时间:
2018-07
期刊:
影响因子:
--
通讯作者:
Wenxing Zhu
中科院分区:
文献类型:
--
作者:
Xingquan Li;Bei Yu;Jiaojiao Ou;Jianli Chen;David Z Pan;Wenxing Zhu
Inserting redundant vias is necessary for improving via yield in circuit designs. Block copolymer directed self-assembly (DSA) is an emerging and promising lithography technology for the manufacture of vias and redundant vias, in which guiding templates are used to enhance the resolution. Considering manufacturability of via layer, multiple patterning (MP) lithography is also needed in advanced designs. In this paper, we study the redundant via insertion and guiding template assignment for DSA with MP problem at the postrouting stage. We propose a graph-methodology-based solution framework. First, by analyzing the structure of guiding templates, we propose a new solution expression by introducing the concept of multiplet to discard redundant solutions, and then, honoring the compact solution expression, we construct a conflict graph on the grid model. Second, we formulate the problem with single patterning (SP) as a constrained maximum weight-independent set problem, for which a fast linear interpolation algorithm is introduced to obtain a local optimal solution. To avoid undesirable local optima, we propose an effective initial solution generation method. Our framework is general and is further extended to solve the problem with double patterning (DP) or triple patterning (TP) in a two-stage manner. Experimental results validate the efficiency and effectiveness of our method. Specifically, compared with the state-of-the-art work for the problem with SP, DP, and TP, our method can save 58%, 82%, and 96% runtime, respectively.
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影响因子:
1.1
作者:
Frieze, A;Jerrum, M
通讯作者:
Jerrum, M
DOI:
10.1145/1118299.1118376
发表时间:
2006-01
期刊:
Asia and South Pacific Conference on Design Automation, 2006.
影响因子:
--
作者:
Kuang‐Yao Lee;Ting-Chi Wang
通讯作者:
Kuang‐Yao Lee;Ting-Chi Wang
DOI:
10.1109/iccad.2011.6105297
发表时间:
2008-11
期刊:
2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
影响因子:
--
作者:
Bei Yu;Kun Yuan;Boyang Zhang;Duo Ding;D. Pan
通讯作者:
Bei Yu;Kun Yuan;Boyang Zhang;Duo Ding;D. Pan
DOI:
10.1109/tcad.2008.2006151
发表时间:
2008-12
影响因子:
2.9
作者:
Kuang‐Yao Lee;Cheng-Kok Koh;Ting-Chi Wang;Kai-Yuan Chao
通讯作者:
Kuang‐Yao Lee;Cheng-Kok Koh;Ting-Chi Wang;Kai-Yuan Chao
DOI:
10.1145/2228360.2228579
发表时间:
2012-06
期刊:
DAC Design Automation Conference 2012
影响因子:
--
作者:
Shao-Yun Fang;Yao-Wen Chang;Wei-Yu Chen
通讯作者:
Shao-Yun Fang;Yao-Wen Chang;Wei-Yu Chen