Sequence-resolved free energy profiles of stress-bearing vimentin intermediate filaments
Sequence-resolved free energy profiles of stress-bearing vimentin intermediate filaments
复制标题
受应力波形蛋白中间丝的序列解析自由能分布
DOI:
10.1073/pnas.1403122111
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发表时间:
2014
期刊:
影响因子:
--
通讯作者:
Rief M
中科院分区:
文献类型:
--
作者:
Ramm B;Stigler J;Hinczewski M;Thirumalai D;Herrmann H;Woehlke G;Rief M
Intermediate filaments (IFs) are key to the mechanical strength of metazoan cells. Their basic building blocks are dimeric coiled coils mediating hierarchical assembly of the full-length filaments. Here we use single-molecule force spectroscopy by optical tweezers to assess the folding and stability of coil 2B of the model IF protein vimentin. The coiled coil was unzipped from its N and C termini. When pulling from the C terminus, we observed that the coiled coil was resistant to force owing to the high stability of the C-terminal region. Pulling from the N terminus revealed that the N-terminal half is considerably less stable. The mechanical pulling assay is a unique tool to study and control seed formation and structure propagation of the coiled coil. We then used rigorous theory-based deconvolution for a model-free extraction of the energy landscape and local stability profiles. The data obtained from the two distinct pulling directions complement each other and reveal a tripartite stability of the coiled coil: a labile N-terminal half, followed by a medium stability section and a highly stable region at the far C-terminal end. The different stability regions provide important insight into the mechanics of IF assembly.
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影响因子:
5.6
作者:
Kapinos, Larisa E.;Schumacher, Jens;Herrmann, Harald
通讯作者:
Herrmann, Harald
影响因子:
5.6
作者:
Herrmann, H;Strelkov, SV;Aebi, U
通讯作者:
Aebi, U
影响因子:
8.6
作者:
Douglas B. Staple;M. Loparić;H. Kreuzer;L. Kreplak
通讯作者:
L. Kreplak
DOI:
10.1002/cphc.200900575
发表时间:
2009
期刊:
Chemphyschem : a European journal of chemical physics and physical chemistry
影响因子:
--
作者:
T. Bornschlögl;J. Christof M. Gebhardt;M. Rief
通讯作者:
M. Rief
影响因子:
5.6
作者:
Mücke, N;Kreplak, L;Langowski, J
通讯作者:
Langowski, J