Utilization of low-pressure plasma to inactivate bacterial spores on stainless steel screws.
Utilization of low-pressure plasma to inactivate bacterial spores on stainless steel screws.
复制标题
利用低压等离子体灭活不锈钢螺丝上的细菌孢子
DOI:
10.1089/ast.2012.0949
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发表时间:
2013
期刊:
影响因子:
4.2
通讯作者:
Moeller R
中科院分区:
文献类型:
--
作者:
Stapelmann K;Fiebrandt M;Raguse M;Awakowicz;Reitz G;Moeller R
A special focus area of planetary protection is the monitoring, control, and reduction of microbial contaminations that are detected on spacecraft components and hardware during and after assembly. In this study, wild-type spores ofBacillus pumilusSAFR-032 (a persistent spacecraft assembly facility isolate) and the laboratory model organismB. subtilis168 were used to study the effects of low-pressure plasma, with hydrogen alone and in combination with oxygen and evaporated hydrogen peroxide as a process gas, on spore survival, which was determined by a colony formation assay. Spores ofB. pumilusSAFR-032 andB. subtilis168 were deposited with an aseptic technique onto the surface of stainless steel screws to simulate a spore-contaminated spacecraft hardware component, and were subsequently exposed to different plasmas and hydrogen peroxide conditions in a very high frequency capacitively coupled plasma reactor (VHF-CCP) to reduce the spore burden. Spores of the spacecraft isolateB. pumilusSAFR-032 were significantly more resistant to plasma treatment than spores ofB. subtilis168. The use of low-pressure plasma with an additional treatment of evaporated hydrogen peroxide also led to an enhanced spore inactivation that surpassed either single treatment when applied alone, which indicates the potential application of this method as a fast and suitable way to reduce spore-contaminated spacecraft hardware components for planetary protection purposes. Key Words:Bacillusspores—Contamination—Spacecraft hardware—Plasma sterilization—Planetary protection. Astrobiology 13, 597–606.
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影响因子:
4.2
作者:
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通讯作者:
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影响因子:
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Horneck, Gerda;Moeller, Ralf;Venkateswaran, Kasthuri J.
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Venkateswaran, Kasthuri J.
影响因子:
3.4
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通讯作者:
von Keudell, A.
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4.4
作者:
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通讯作者:
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