Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock
Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock
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热冲击过程中焊点不同界面的亚晶旋转行为研究
DOI：
10.1007/s11664-016-4965-8
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发表时间：
2016-11
影响因子：
2.1
通讯作者：
Guo Fu
中科院分区：
文献类型：
--
作者：
Han Jing;Tan Shihai;Guo Fu
为了研究无铅焊点再结晶区的亚晶旋转行为，对具有横截面边缘排的球栅阵列(BGA)试件进行了热冲击。用电子背散射衍射仪(EBSD)研究了回流焊和热冲击条件下锡颗粒或亚晶的显微组织和取向。取向成像显微镜(OIM)显示，在200次热冲击后，由于孪晶的热膨胀系数(CTE)高度失配，在倾斜的孪晶晶界、芯片侧和印刷电路板(PCB板)侧附近形成了几个亚晶。此外，还选取了焊点芯片侧和印刷电路板侧形成的亚晶来研究无铅焊点中的晶格旋转行为。亚晶旋转分析还表明，芯片侧和印刷电路板侧的亚晶旋转行为不同。这与芯片侧和印刷电路板侧晶体取向存在较大差异密切相关。此外，在300次热冲击后，由于热冲击过程中CTE失配造成的严重变形，在接头的几个部分没有获得电子背散射图案(EBSP)。但选择了4个亚晶，并与初始状态和200次热震条件下的亚晶进行了比较。结果表明，芯片侧的亚晶也绕着[101]和[001]轴旋转，印刷电路板侧的亚晶也绕着[100]轴旋转，这表明亚晶的旋转是一个连续的过程。
In order to investigate subgrain rotation behavior in the recrystallized region of lead-free solder joints, a ball grid array (BGA) specimen with a cross-sectioned edge row was thermally shocked. Electron backscattered diffraction (EBSD) was used to obtain the microstructure and orientations of Sn grains or subgrains in as-reflowed and thermally shocked conditions. Orientation imaging microscopy (OIM) showed that several subgrains were formed at the tilted twin grain boundaries, near the chip side and near the printed circuit board (PCB) side after 200 thermal shocks due to a highly mismatched coefficient of thermal expansion (CTE) of twin grains. Also, subgrains formed at the chip side and PCB side in the solder joint were selected to research the grain rotation behavior in lead-free solder joints. The analysis of subgrain rotation also indicated that the rotation behavior of subgrains was different between the chip side and PCB side. It was closely related with the large different crystal orientations between the chip side and PCB side. Furthermore, electron backscattered patterns (EBSPs) at several parts of the joint were not obtained after 300 thermal shocks due to the serious deformation caused by mismatched CTE during thermal shock. But 4 subgrains were selected and compared with that of the initial state and 200-thermal shock conditions. The results showed that the subgrains at the chip side were also rotated around the Sn [101] and [001] axes and the subgrains at the PCB side were also rotated around the Sn [100] axis, which indicated a continuous process of subgrain rotation.
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影响因子：
2.1
作者：
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通讯作者：
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影响因子：
2.1
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影响因子：
2.1
作者：
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影响因子：
2.1
作者：
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影响因子：
2.1
作者：
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通讯作者：
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