Theoretical study of 2D sub-wavelength structure fabrication via surface plasmon excitation utilizing the enhanced Kretschmann structure combined with sample rotation
Theoretical study of 2D sub-wavelength structure fabrication via surface plasmon excitation utilizing the enhanced Kretschmann structure combined with sample rotation
复制标题
利用增强型 Kretschmann 结构结合样品旋转通过表面等离子体激发制造二维亚波长结构的理论研究
DOI:
10.1007/s11082-022-03596-w
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发表时间:
2022-03
影响因子:
3
通讯作者:
Xiaolei Wen
中科院分区:
文献类型:
--
作者:
Tianxu Jia;Yaqian Ren;Xiangxian Wang;Yunping Qi;Xiaolei Wen
A theoretical method of nanoscale lithography based on the enhanced Kretschmann structure and excitation of surface plasmons to fabricate periodic 2D sub-wavelength structures is proposed in this paper. The optical field distribution, which is greatly enhanced by using the enhanced Kretschmann structure, can be determined using the finite element method and related formulas to simulate rotation and exposure of a lithography sample. Consequently, various sub-wavelength structures can be modeled through different rotation methods and exposure times, such as square dot arrays, quasi-hexagonally close-packed structures, and circular grating structures. In addition, if the metal and dielectric materials are determined, various reflection spectra can be chosen from by combining different metal and dielectric thicknesses. This proposed method has the advantages of low cost, high resolution, and high efficiency, providing a prospective fabrication method for 2D sub-wavelength structures in practical applications.
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DOI:
10.1116/1.3276702
发表时间:
2010-01
期刊:
Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
影响因子:
--
作者:
K. V. Sreekanth;V. M. Murukeshan
通讯作者:
K. V. Sreekanth;V. M. Murukeshan
影响因子:
1.7
作者:
Wang Xiangxian;Zhu Jiankai;Tong Huan;Yang Xudong;Wu Xiaoxiong;Pang Zhiyuan;Yang Hua;Qi Yunping
通讯作者:
Qi Yunping
影响因子:
4.7
作者:
Chen, Jing;Nie, Hai;Park, Gun-Sik
通讯作者:
Park, Gun-Sik
影响因子:
3.1
作者:
Guan, Sitao;Li, Ruishan;Yang, Hua
通讯作者:
Yang, Hua
影响因子:
2
作者:
K. V. Sreekanth;V. M. Murukeshan
通讯作者:
K. V. Sreekanth;V. M. Murukeshan