Investigation of through micropatterns fabrication on C194 copper foil by ultraviolet nanosecond pulsed laser microdrilling
Investigation of through micropatterns fabrication on C194 copper foil by ultraviolet nanosecond pulsed laser microdrilling
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紫外纳秒脉冲激光微钻孔在C194铜箔上加工微图案的研究
DOI：
10.1016/j.optlastec.2022.109092
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发表时间：
2023
影响因子：
5
通讯作者：
Tao Sun
中科院分区：
文献类型：
--
作者：
Yujie Han;Junjie Zhang;Yuan Liu;Min Sheng;Xiaohui Wang;Tao Sun
虽然广泛用于IC封装的C194铜合金引线框架包含高密度的贯通微图案，但是高度需要在厚度低至几百微米的铜箔上实现高精度制造微图案的方法。在目前的工作中，我们证明了高密度通过C194铜箔的高精度和高均匀性的微图案，通过使用紫外纳秒脉冲激光微钻孔的可行性。具体而言，C194铜箔的吸收系数为355 nm波长的实验推导出，基于此材料的升华焓校准通过迭代比较预测的弹坑形态通过有限元模拟与实验数据。通过有限元模拟和实验研究了C194铜箔的多脉冲激光烧蚀机理，得到了C194铜箔烧蚀坑深度与激光烧蚀参数的定量关系。最后，利用所提出的紫外纳秒脉冲激光微打孔技术，在厚度为100 μm的C194铜箔上制备了高密度、高尺寸精度、高均匀性的贯通微图形阵列。此外，酸洗的表面质量和制造的铜引线框架的电阻的影响被解决。本工作为通过微图形以环境友好的方式制造高精度铜合金引线框架提供了一种可行的方法。
While the lead frames of C194 copper alloy widely used in IC packages contain high density of through micropatterns, the method for realizing high precision manufacturing of the micropatterns on copper foil with thickness down to a few hundred micrometers is highly demanded. In the present work, we demonstrate the feasibility of manufacturing high density through micropatterns on C194 copper foil with high precision and high uniformity by using ultraviolet nanosecond pulsed laser microdrilling. Specifically, the absorption coefficient of C194 copper foil for 355 nm wavelength is experimentally derived, based on which the sublimation enthalpy of the material is calibrated by iteratively comparing predicted crater morphology by finite element simulations with experimental data. Then the multi-pulse laser ablation mechanisms of C194 copper foil are investigated jointly by finite element simulations and experiments, which derive the quantitative correlation of ablation crater depth with laser ablation parameters. Finally, high density arrays of through micropatterns with high dimensional accuracy and high uniformity are fabricated on C194 copper foil with a thickness of 100 μm by the proposed ultraviolet nanosecond pulsed laser microdrilling with theoretically predicted repeat scanning number. Furthermore, the effect of pickling on surface quality and resistance of the manufactured copper lead frame is addressed. This work provides a feasible method for manufacturing copper alloy lead frames with high precision through micropatterns in an environmentally friendly manner.
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