Unstable cracking behavior in nanoscale single crystal silicon: Initiation, unstable propagation and arrest

Unstable cracking behavior in nanoscale single crystal silicon: Initiation, unstable propagation and arrest
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纳米级单晶硅的不稳定裂纹行为:起始、不稳定扩展和停止

DOI:
10.1016/j.engfracmech.2018.04.014
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发表时间:
2018-06
期刊:
Engineering Fractrue Mechanics
影响因子:
--
通讯作者:
Kitamura Takayuki
Kitamura Takayuki
中科院分区:
其他
文献类型:
--
作者:
Huang Kai;Sumigawa Takashi;Guo Licheng;Yan Yabin;Kitamura Takayuki

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采用纳米尺度双电子束方法,对纳米尺度单晶硅的失稳开裂行为进行了实验观察,包括裂纹的萌生、失稳扩展和止裂。设计了一个控制良好的多步开裂实验,以准确地估算断裂韧度KIc和止裂韧度KIa。实验结果表明,在几百纳米的短距离内,不稳定裂纹导致K_(Ic)明显降低到K_(Ia),即K_(Ia)< K_(Ic),并产生令人惊讶的清洁裂纹表面,能量耗散可忽略不计。准确地计算出纳米单晶硅(0 1 1)解理面的比表面能γ= 1 83J m2。这些结果提供了一个基本的理解在纳米级的脆性材料的不稳定开裂行为。
The unstable cracking behavior in nanoscale single crystal silicon, including initiation, unstable propagation and arrest, is experimentally observed by using a nanoscale trapezoidal-double-cantilever-beam method. A well-controlled multi-step cracking experiment is designed for accurately estimating both the fracture toughness K Ic and the arrest toughness K Ia. The experimental results show that the unstable cracking within a short range of hundreds of nanometers leads to an apparent decrease from K Ic to K Ia, ie, K Ia< K Ic, and produces surprisingly clean crack surfaces with negligible energy dissipation. The specific surface energy of (0 1 1) cleavage plane in nanoscale single crystal silicon is accurately evaluated as γ= 1.83 J/m 2. These results provide a fundamental understanding of the unstable cracking behavior in a brittle material at the nanoscale.
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