Unstable cracking behavior in nanoscale single crystal silicon: Initiation, unstable propagation and arrest
Unstable cracking behavior in nanoscale single crystal silicon: Initiation, unstable propagation and arrest
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纳米级单晶硅的不稳定裂纹行为:起始、不稳定扩展和停止
DOI:
10.1016/j.engfracmech.2018.04.014
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发表时间:
2018-06
期刊:
影响因子:
--
通讯作者:
Kitamura Takayuki
中科院分区:
文献类型:
--
作者:
Huang Kai;Sumigawa Takashi;Guo Licheng;Yan Yabin;Kitamura Takayuki
The unstable cracking behavior in nanoscale single crystal silicon, including initiation, unstable propagation and arrest, is experimentally observed by using a nanoscale trapezoidal-double-cantilever-beam method. A well-controlled multi-step cracking experiment is designed for accurately estimating both the fracture toughness K Ic and the arrest toughness K Ia. The experimental results show that the unstable cracking within a short range of hundreds of nanometers leads to an apparent decrease from K Ic to K Ia, ie, K Ia< K Ic, and produces surprisingly clean crack surfaces with negligible energy dissipation. The specific surface energy of (0 1 1) cleavage plane in nanoscale single crystal silicon is accurately evaluated as γ= 1.83 J/m 2. These results provide a fundamental understanding of the unstable cracking behavior in a brittle material at the nanoscale.
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