Low-Cost Aperture-Coupled 60-GHz-Phased Array Antenna Package With Compact Matching Network
Low-Cost Aperture-Coupled 60-GHz-Phased Array Antenna Package With Compact Matching Network
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具有紧凑匹配网络的低成本孔径耦合 60GHz 相控阵天线封装
DOI：
10.1109/tap.2017.2722867
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发表时间：
2017-07
影响因子：
5.7
通讯作者：
Cui Tie Jun
中科院分区：
文献类型：
--
作者：
Zhang Tao;Li Lianming;Xie Min;Xia Haiyang;Ma Xujun;Cui Tie Jun
为 60 GHz 相控阵系统提出了一种采用标准印刷电路板 (PCB) 工艺的低成本多层封装天线解决方案。设计过程的重点是克服制造限制并实现低成本、宽带、紧凑且可靠的封装解决方案。该多层堆叠结构由三层叠层和两层bondply层组成，通过该结构实现了天线元件、垂直准同轴过孔过渡、天线馈线、电源和低速接口。提出、制造并测量了一种具有紧凑扇形馈电网络和垂直准同轴过孔过渡的孔径耦合贴片天线。对于单个天线元件，包括垂直准同轴过孔过渡，测得的分数阻抗带宽（<inline-formula> <tex-math notation="LaTeX">$\vert \text{S}11\vert < -10$ </tex-math></inline-formula> dB）为 20.2%，测得的峰值增益在 62 GHz 时为 6.9 dBi。基于单天线，实现了尺寸为 14 mm <inline-formula> <tex-math notation="LaTeX">$\times14$ </tex-math></inline-formula> mm <inline-formula> <tex-math notation="LaTeX">$\times0.925$ </tex-math></inline-formula> mm 的 16 元件天线封装。测量结果表明，每个天线元件在 57.2 至 64.5 GHz 范围内的 <inline-formula> <tex-math notation="LaTeX">$\vert \text{S}11\vert $ </tex-math></inline-formula> 小于 -10 dB，在所有四个 IEEE 802.15.3c 通道上实现 4–7.5 dBi 增益。
A low-cost multilayer antenna-in-package solution, using the standard printed-circuit-board (PCB) process, is proposed for the 60-GHz-phased array system. The design procedure focuses on overcoming the fabrication restrictions and realizing a low-cost, broadband, compact and reliable package solution. The multilayer stack-up structure consists of three laminates and two bondply layers, with which the antenna element, vertical quasi-coaxial via transition, antenna feedline, power, and low-speed interfaces are realized. An aperture-coupled patch antenna with a compact fan-shaped feeding network and a vertical quasi-coaxial via transition are proposed, fabricated, and measured. For the single antenna element, including the vertical quasi-coaxial via transition, the measured fractional impedance bandwidth (<inline-formula> <tex-math notation="LaTeX">$\vert \text{S}11\vert < -10$ </tex-math></inline-formula> dB) is 20.2%, and the measured peak gain is 6.9 dBi at 62 GHz. Based on the single antenna, a 16-element antenna package is realized in the dimension of 14 mm <inline-formula> <tex-math notation="LaTeX">$\times14$ </tex-math></inline-formula> mm <inline-formula> <tex-math notation="LaTeX">$\times0.925$ </tex-math></inline-formula> mm. Measurements show that each antenna element achieves a <inline-formula> <tex-math notation="LaTeX">$\vert \text{S}11\vert $ </tex-math></inline-formula> less than −10 dB from 57.2 to 64.5 GHz, 4–7.5 dBi gain across all four IEEE 802.15.3c channels.
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影响因子：
4.3
作者：
A. Amadjikpe;Debabani Choudhury;C. Patterson;Benjamin Lacroix;G. Ponchak;John Papapolymerou
通讯作者：
A. Amadjikpe;Debabani Choudhury;C. Patterson;Benjamin Lacroix;G. Ponchak;John Papapolymerou
DOI：
10.1109/rfic.2012.6242317
发表时间：
2012-06
影响因子：
4.3
作者：
E. Cohen;M. Ruberto;M. Cohen;O. Degani;S. Ravid;D. Ritter
通讯作者：
E. Cohen;M. Ruberto;M. Cohen;O. Degani;S. Ravid;D. Ritter
影响因子：
5.7
作者：
J. Akkermans;M. Herben;M. C. Beurden
通讯作者：
J. Akkermans;M. Herben;M. C. Beurden
DOI：
10.1109/tcpmt.2011.2169064
发表时间：
2011-10
期刊：
IEEE Transactions on Components, Packaging and Manufacturing Technology
影响因子：
--
作者：
D. Kam;Duixian Liu;Arun Natarajan;Scott K. Reynolds;Brian A. Floyd
通讯作者：
D. Kam;Duixian Liu;Arun Natarajan;Scott K. Reynolds;Brian A. Floyd
影响因子：
5.7
作者：
Miao Zhang;K. Toyosaki;J. Hirokawa;M. Ando;T. Taniguchi;M. Noda
通讯作者：
Miao Zhang;K. Toyosaki;J. Hirokawa;M. Ando;T. Taniguchi;M. Noda