Effect of bilayer period on structural and mechanical properties of nanocomposite TiAlN/MoN multilayer films synthesized by cathodic arc ion-plating
Effect of bilayer period on structural and mechanical properties of nanocomposite TiAlN/MoN multilayer films synthesized by cathodic arc ion-plating
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双层周期对阴极电弧离子镀纳米复合TiAlN/MoN多层薄膜结构和力学性能的影响
DOI：
10.1016/j.surfcoat.2015.10.018
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发表时间：
2015-11
影响因子：
5.4
通讯作者：
D.J. F
中科院分区：
文献类型：
--
作者：
V.O. Pelenovich;B. Yang;C.S. Liu;D.J. F
采用旋转1倍的阴极电弧离子镀系统，以TiAl和Mo为靶材，在Si（100）和硬质合金基体上制备了TiAlN/MoN多层膜。所有层的双层厚度（Λ）通过衬底保持器的旋转速度控制在21至124 nm的范围内。TiAlN/MoN具有多层结构，其中纳米晶体TiAlN层与纳米晶体MoN层交替。通过EDS测量的所有样品的Ti：Al比接近于设计的比率，并且对应于Ti 0.70Al 0.30N组成。TiAlN/MoN纳米多层膜具有TiAlN（200）、TiAlN（220）、MoN（202）和MoN（200）晶向。最高的硬度和杨氏模量与双层周期为25 nm，而磨损率随双层周期的减少而降低。平均而言，纳米压痕测量结合原子力显微镜（AFM）和横截面扫描电子显微镜（SEM）显示TiAlN/MoN薄膜的机械性能的改善，减少双层周期归因于其致密的微观结构与细晶粒的发展和降低表面粗糙度。
TiAlN/MoN multilayers were deposited on Si (100) and cemented carbide substrates using TiAl and Mo targets in a cathodic arc ion plating system with 1-fold rotation. The bilayer thickness (Λ) of all the layers was controlled via rotational speed of substrate holder within a rage of 21 to 124 nm. The TiAlN/MoN has a multilayered structure in which nano-crystalline TiAlN layers alternate with the nano-crystalline MoN layers. The Ti:Al ratios measured by EDS over all samples were closed to the designed ratio and corresponded to Ti0.70Al0.30N composition. TiAlN/MoN nanoscale multilayer thin films exhibited a TiAlN (200), TiAlN (220), MoN (202) and MoN (200) crystalline orientation. The highest hardness and Young's modulus were obtained with a bilayer period of 25 nm, while wear rate decreased with decreasing bilayer period. On average, nanoindentation measurements combined with atomic force microscopy (AFM) and cross-sectional scanning electron microscopy (SEM) revealed improved mechanical properties of TiAlN/MoN films with decreasing bilayer period were attributed to their densified microstructure with development of fine grains and reduced surface roughness.
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影响因子：
4.6
作者：
Kwang-Lung Lin;M. Hwang;Cheng-Dau Wu
通讯作者：
Kwang-Lung Lin;M. Hwang;Cheng-Dau Wu
影响因子：
4
作者：
Beckers, M.;Schell, N.;Moeller, W.
通讯作者：
Moeller, W.
影响因子：
2.1
作者：
W. Sproul;R. Rothstein
通讯作者：
W. Sproul;R. Rothstein
影响因子：
5.4
作者：
Youn J. Kim;T. J. Byun;H. Lee;J. Han
通讯作者：
Youn J. Kim;T. J. Byun;H. Lee;J. Han
DOI：
10.1016/s0007-8506(07)60158-9
发表时间：
2005
期刊：
CIRP Annals
影响因子：
--
作者：
L. Settineri
通讯作者：
L. Settineri