Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM
Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM
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(111)纳米孪晶铜UBM微凸块中优先取向屋顶型Cu6Sn5晶粒形成机制
DOI：
10.1016/j.matchar.2021.111316
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发表时间：
2021-09
影响因子：
4.7
通讯作者：
S.N. Zhang
中科院分区：
文献类型：
--
作者：
Yang Wu;Mingliang Huang;S.N. Zhang
将（111）纳米孪晶铜薄膜作为一种新型的凸点下金属化（UBM）材料应用于微凸点3D封装工艺中。通过在不同温度（250 °C和300 °C）下钎焊，研究了（111）纳米孪晶Cu UBM上界面Cu 6Sn 5晶粒的取向和形貌.在较高的钎焊温度（300 °C）下，Sn/（111）纳米孪晶Cu界面上形成了（11−20）择优取向的屋顶型Cu 6Sn 5金属间化合物（IMC），而在较低的钎焊温度（250 °C）下，Sn/（111）纳米孪晶Cu界面上形成了无规取向的扇贝型Cu 6Sn 5晶粒。屋顶型Cu 6 Sn 5晶粒和（111）纳米孪晶Cu UBM之间的择优取向关系为{11−20} Cu 6 Sn 5|| {111}铜，含0001 Cu 6Sn 5|| 011纯铜和{11-20} Cu 6Sn 5|| {111}铜，单位：<$10 −10 <$Cu6Sn5|| 112公斤铜。此外，（111）纳米孪晶铜/Sn/（111）纳米孪晶铜焊料互连在300 °C下焊接的平均剪切强度（40.19 MPa）比在250 °C下焊接的平均剪切强度（31.09 MPa）高30%。本研究提供了一个洞察控制界面的Cu 6 Sn 5晶粒的形态和取向的（111）纳米孪晶铜用作UBM的3D封装应用。·在（111）nt-Cu UBM上形成的屋顶型Cu 6Sn 5晶粒的随机交叉角。·OR：{11-20} η|| {111} Cu in η|| Cu，{11-20} η|| {111} Cu in η|| Cu .·在300 °C下焊接的焊料互连的平均剪切强度为40.19 MPa。
The (111) nanotwinned copper films used as a novel under bump metallization (UBM) were applied in micro-bump solder technology for 3D packaging. The orientation and morphology of interfacial Cu 6 Sn 5 grains on (111) nanotwinned copper UBMs were investigated by soldering at different temperatures (250 °C and 300 °C). The (11−20) preferred orientation roof-type Cu 6 Sn 5 intermetallic compound (IMC) formed on Sn/(111) nanotwinned copper interface at a higher soldering temperature of 300 °C; while random orientation scallop-type Cu 6 Sn 5 grains formed on Sn/(111) nanotwinned copper interface at lower soldering temperature of 250 °C. The preferred orientation relationships between and interfacial roof-type Cu 6 Sn 5 grains and (111) nanotwinned copper UBMs are {11−20} Cu6Sn5 ||{111} copper in 〈0001〉 Cu6Sn5 ||〈011〉 copper and {11–20} Cu6Sn5 ||{111} copper in 〈10−10〉 Cu6Sn5 ||〈112〉 copper . Moreover, the average shear strength of the (111) nanotwinned copper/Sn/(111) nanotwinned copper solder interconnects soldered at 300 °C (40.19 MPa) is 30% higher than that soldered at 250 °C (31.09 MPa). This study provides an insight in controlling the morphology and orientation of interfacial Cu 6 Sn 5 grains on the (111) nanotwinned copper used as UBMs for the 3D packaging application. • Random intersecting angles of roof-type Cu 6 Sn 5 grains formed on (111) nt-Cu UBM. • ORs: {11–20} η ||{111} Cu in η || Cu , {11–20} η ||{111} Cu in η|| Cu . • Average shear strength of the solder interconnects soldered at 300 °C is 40.19 MPa.
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DOI：
10.1109/ectc.2019.00274
发表时间：
2019-05
期刊：
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
影响因子：
--
作者：
Mingliang L. Huang;L. Zou
通讯作者：
Mingliang L. Huang;L. Zou
影响因子：
56.9
作者：
Chen, Kuan-Chia;Wu, Wen-Wei;Tu, K. N.
通讯作者：
Tu, K. N.
影响因子：
3
作者：
Chou, Tzu-Ting;Song, Rui-Wen;Duh, Jenq-Gong
通讯作者：
Duh, Jenq-Gong
DOI：
10.1109/ectc.2019.00265
发表时间：
2019-05
期刊：
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
影响因子：
--
作者：
H. Hung;Sean Yang;I. Weng;Yan-Hao Chen;C. Kao
通讯作者：
H. Hung;Sean Yang;I. Weng;Yan-Hao Chen;C. Kao
影响因子：
9.4
作者：
Wen, Haiming;Topping, Troy D.;Lavernia, Enrique J.
通讯作者：
Lavernia, Enrique J.