Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
复制标题
长时间测量定制单相浸没式冷却服务器在各种高温和低温下的热性能
DOI:
10.1115/1.4045156
复制
发表时间:
2020
影响因子:
1.6
通讯作者:
Tufty, Rick
中科院分区:
文献类型:
--
作者:
Bansode, Pratik V.;Shah, Jimil M.;Gupta, Gautam;Agonafer, Dereje;Patel, Harsh;Roe, David;Tufty, Rick
The next radical change in the thermal management of data centers is to shift from conventional cooling methods like air-cooling to direct liquid cooling to enable high thermal mass and corresponding superior cooling. There has been in the past few years a limited adoption of direct liquid cooling in data centers because of its simplicity and high heat dissipation capacity. Single-phase engineered fluid immersion cooling has several other benefits like better server performance, even temperature profile, and higher rack densities and the ability to cool all components in a server without the need for electrical isolation. The reliability aspect of such cooling technology has not been well addressed in the open literature. This paper presents the performance of a fully single-phase dielectric fluid immersed server over wide temperature ranges in an environmental chamber. The server was placed in an environmental chamber and applied extreme temperatures ranging from −20 °C to 10 °C at 100% relative humidity and from 20 to 55 °C at constant 50% relative humidity for extended durations. This work is a first attempt of measuring the performance of a server and other components like pump including flow rate drop, starting trouble, and other potential issues under extreme climatic conditions for a completely liquid-submerged system. Pumping power consumption is directly proportional to the operating cost of a data center. The experiment was carried out until the core temperature reached the maximum junction temperature. This experiment helps to determine the threshold capacity and the robustness of the server for its applications in extreme climatic conditions.
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DOI:
10.1115/ipack2018-8432
发表时间:
2018
期刊:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
影响因子:
--
作者:
Bansode, Pratik V.;Shah, Jimil M.;Gupta, Gautam;Agonafer, Dereje;Patel, Harsh;Roe, David;Tufty, Rick
通讯作者:
Tufty, Rick
影响因子:
1.6
作者:
Shah, Jimil M.;Eiland, Richard;Rajmane, Pavan;Siddarth, Ashwin;Agonafer, Dereje;Mulay, Veerendra
通讯作者:
Mulay, Veerendra
DOI:
--
发表时间:
2015
期刊:
影响因子:
--
作者:
R. Eiland
通讯作者:
R. Eiland
影响因子:
1.6
作者:
Eiland, Richard;Edward Fernandes, John;Vallejo, Marianna;Siddarth, Ashwin;Agonafer, Dereje;Mulay, Verrendra
通讯作者:
Mulay, Verrendra
DOI:
--
发表时间:
2014
期刊:
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
影响因子:
--
作者:
R. Eiland;J. Fernandes;M. Vallejo;D. Agonafer;V. Mulay
通讯作者:
V. Mulay