Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
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DOI：
10.3390/ma2041796
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发表时间：
2009-11-11
期刊：
影响因子：
3.4
通讯作者：
Vuorinen V
中科院分区：
文献类型：
--
作者：
Laurila T;Vuorinen V
在这篇论文中，我们将演示如何利用热力学-动力学方法来解释锡基无铅焊料和镍金属化之间的一系列界面现象。首先，将讨论P对锡基焊料和化学镀镍/浸金(ENIG)金属化之间界面反应的影响，从而对可靠性的影响。接下来，将讨论锡基焊料中微量铜对金属间化合物(IMC)的影响，IMC首先形成在镍金属化的顶部。借助热力学理论，可以确定形成(Cu，Ni)6Sn5的所谓临界铜浓度是温度的函数。然后详细讨论了在Ni3Sn4金属间化合物上再沉积(Au，Ni)Sn4层的重要现象。导致这种行为的原因将在热力学信息的帮助下合理化，并解释为什么当焊接系统中存在适量的铜时，这种现象不会发生。最后讨论了与低温锡锌和锡铋基焊料及镍金属化有关的界面反应问题。
In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG) metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC), which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni)6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,Ni)Sn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed.
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影响因子：
2.1
作者：
BUENE, L;FALKENBERGARELL, H;TAFTO, J
通讯作者：
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影响因子：
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影响因子：
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影响因子：
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影响因子：
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