Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging
Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging
复制标题
用于裸芯片 SMT（表面安装技术）封装的全前端批量微加工单芯片微流量传感器
DOI：
10.1088/0960-1317/22/3/035020
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发表时间：
2012-03
影响因子：
2.3
通讯作者：
Li, Xinxin
中科院分区：
文献类型：
--
作者：
Liu, Jiedan;Wang, Jiachou;Li, Xinxin
本文报道了一种新型的基于单晶片的压阻式微流量传感器，该传感器仅从硅片的正面进行体微加工，以便于传感器裸芯片直接封装到微流体系统中，采用低成本的表面安装技术（SMT）。在既不需要双面微机械加工也不需要多晶片接合的情况下，两种结构类型的压阻式流量传感器被设计并制造在（111）晶片中，其中“类型A”传感器与“类型B”传感器相比具有更小的通道横截面积。在裸传感器芯片直接附接在印刷电路板（PCB）上、焊盘与PCB之间的引线接合以用于电互连以及入口/出口前侧连接之后，去离子水流入两种类型的流量传感器中，以根据流量来表征压差感测元件的压阻输出。对于均采用DC 5 V供电的“A型”和“B型”传感器，灵敏度依次测得为766.80 mV（µL s−1）−1和19.12 mV（µL s−1）−1，非线性度分别为0.4% FS和0.9% FS。与传统的微流量传感器相比，单芯片制作的差压式流量传感器可以低成本批量生产。此外，裸传感器芯片可以简单地进行SMT封装，用于低成本的微系统应用。
This paper reports novel single-wafer-based piezoresistive micro flow sensors, which are bulk micromachined only from the front side of the silicon wafer to facilitate the sensor-bare chips directly packaged into micro-fluidic systems with low-cost surface mounting technology (SMT). With neither double-sided micromachining nor multiwafer bonding needed, two structural types of the piezoresistive flow sensors are designed and fabricated in (1 1 1) wafers, where ‘type A’ sensor has a smaller channel cross section area compared to ‘type B’ sensor. After the bare sensor chip directly attached on a printed circuit board (PCB), wire bonded between the pads and the PCB for electric interconnection and the inlet/outlet front side connected, deionized water is flowed into the both types of flow sensors to characterize piezoresistive output of the differential pressure sensing elements in terms of the flow rate. For ‘type A’ and ‘type B’ sensors that are both power supplied with DC 5 V, the sensitivities are sequentially measured as 766.80 mV (µL s−1)−1 and 19.12 mV (µL s−1)−1, with the nonlinearities as 0.4% FS and 0.9% FS, respectively. Compared with traditionally fabricated micro flow sensors, the single-chip fabricated differential-pressure flow sensors can be low-cost volume manufactured. Moreover, the bare sensor chips can be simply SMT packaged for low-cost micro-system applications.
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影响因子：
4.6
作者：
Wu, SY;Lin, Q;Tai, YC
通讯作者：
Tai, YC
DOI：
10.3390/s90604138
发表时间：
2009
期刊：
Sensors (Basel, Switzerland)
影响因子：
--
作者：
Liu Y;Chen L;Sun L
通讯作者：
Sun L
DOI：
10.1109/iedm.1999.824248
发表时间：
1999
期刊：
International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318)
影响因子：
--
作者：
Sangwoo Lee;Sangjun Park;Dong-il Cho;Yongsoo Oh
通讯作者：
Sangwoo Lee;Sangjun Park;Dong-il Cho;Yongsoo Oh
DOI：
--
发表时间：
2006
期刊：
--
影响因子：
--
作者：
Marcel Dijkstra;T. Lammerink;R. Wiegerink;M. Elwenspoek
通讯作者：
Marcel Dijkstra;T. Lammerink;R. Wiegerink;M. Elwenspoek
影响因子：
4.6
作者：
LAMMERINK, TSJ;TAS, NR;FLUITMAN, JHJ
通讯作者：
FLUITMAN, JHJ