Preparing bulk Cu-Ni-Mn based thermoelectric alloys and synergistically improving their thermoelectric and mechanical properties using nanotwins and nanoprecipitates
Preparing bulk Cu-Ni-Mn based thermoelectric alloys and synergistically improving their thermoelectric and mechanical properties using nanotwins and nanoprecipitates
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制备块状 Cu-Ni-Mn 基热电合金并利用纳米孪晶和纳米沉淀物协同提高其热电和机械性能
DOI:
10.1016/j.mtphys.2020.100332
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发表时间:
2020-12
影响因子:
11.5
通讯作者:
Wang T.
中科院分区:
文献类型:
--
作者:
Kang H.;Yang Z.;Yang X.;Li J.;He W.;Chen Z.;Guo E.;Zhao L-D;Wang T.
Cu-Ni-Mn based alloys have long been considered as potential thermoelectric materials because of their Seebeck effect and large power factor. In this study, bulk Cu-Ni-Mn based alloys with nanostructures were prepared via melting and cryorolling, and their thermoelectric and mechanical properties were analyzed. A large number of nanotwins and nanoprecipitates were observed in the prepared alloys using transmission electron microscopy. These observations indicate that the bulk Cu-Ni-Mn alloys with nanostructures can be successfully prepared using conventional melting-solidification-rolling technology. The Cu-Ni-Mn alloy containing nanotwins exhibits a promising Seebeck coefficient of ∼ −72.8 μVK−1and power factor of ∼11000 μWm−1K−2at 1073 K, and thereby, a high output power density. The bulk Zr-doped Cu-Ni-Mn alloy containing nanoprecipitates and nanotwins exhibits a lower thermal conductivity of ∼32.9 Wm−1K−1and a 37.5% higherZTof ∼0.22 at 773 K. Enhanced mechanical properties make the Cu-Ni-Mn based alloys a promising candidate for thermoelectric application. Our discovery provides a promising strategy to improve the thermoelectric and mechanical properties of materials with high thermal conductivity through the introduction of nanotwins and nanoprecipitates.
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DOI:
10.1073/pnas.1111419109
发表时间:
2012-06-19
影响因子:
11.1
作者:
Wang, Heng;Pei, Yanzhong;Snyder, G. Jeffrey
通讯作者:
Snyder, G. Jeffrey
影响因子:
4.6
作者:
Yu, Hailiang;Lu, Cheng;Tieu, A. Kiet;Godbole, Ajit;Su, Lihong;Sun, Yong;Liu, Mao;Tang, Delin;Kong, Charlie
通讯作者:
Kong, Charlie
影响因子:
17.6
作者:
Mao, Jun;Wang, Yumei;Ren, Zhifeng
通讯作者:
Ren, Zhifeng
影响因子:
11.5
作者:
D;an Qin;Wenjing Shi;Wenhua Xue;Haixu Qin;Jian Cao;Wei Cai;Yumei Wang;Jiehe Sui
通讯作者:
Jiehe Sui
影响因子:
2.3
作者:
A. Sugihara;M. Kodzuka;K. Yakushiji;H. Kubota;S. Yuasa;A. Yamamoto;K. Ando;K. Takanashi;T. Ohkubo;K. Hono;A. Fukushima
通讯作者:
A. Sugihara;M. Kodzuka;K. Yakushiji;H. Kubota;S. Yuasa;A. Yamamoto;K. Ando;K. Takanashi;T. Ohkubo;K. Hono;A. Fukushima