Boron doped bcc-W films: Achieving excellent mechanical properties and tribological performance by regulating substrate bias voltage
Boron doped bcc-W films: Achieving excellent mechanical properties and tribological performance by regulating substrate bias voltage
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硼掺杂bcc-W薄膜:通过调节基底偏压实现优异的机械性能和摩擦学性能
DOI:
10.1016/j.apsusc.2017.06.185
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发表时间:
2017-11
影响因子:
6.7
通讯作者:
Mao Wen
中科院分区:
文献类型:
--
作者:
Lina Yang;Kan Zhang;Yi Zeng;Xin Wang;Suxuan Du;Chuanying Tao;Ping Ren;Xiaoqiang Cui;Mao Wen
Boron dopedbcc-W (WBx,x= B/W) films were deposited on Si(100) substrates by magnetron co-sputtering pure W and B targets. Our results reveal that when the absolute value of substrate bias voltage (Vb) increases from floating to 240 V, the value ofxmonotonously decreases from 0.18 to 0.04, accompanied by a phase transition from a mixture of tetragonal γ-W2B and body-centered cubic α-W(B) phase (−Vb≤ 60 V) to α-W(B) single phase (−Vb>60 V). Hardness, depending onVb, increases first and then drops, where the maximum hardness of 30.8 GPa was obtained at −Vb=60 V and far higher than pure W and W2B theoretical value. In the mixed phase structure, the grain boundaries strengthening, Hall-Petch effect and solid-solution strengthening induced by B dominate the strengthening mechanism. Astonishingly, the film grown at −Vb=120 V still possesses twice higher hardness than pure W, wherein unexpectedly low (6.7 at.%) B concentration and only the single α-W(B) phase can be identified. In this case, both Hall-Petch effect and solid-solution strengthening work. Besides, low friction coefficient of ∼0.18 can be obtained for the films with α-W(B) phase, which is competitive to that of reported B-rich transition-metal borides, such as TiB2, CrB and CrB2.
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DOI:
10.1002/pssa.201228828
发表时间:
2013-06-01
影响因子:
2
作者:
Jiang, Chunlei;Pei, Zhiliang;Sun, Chao
通讯作者:
Sun, Chao
影响因子:
6.2
作者:
P. Stempfle;Olivier Pantalé;Toufik Djilali;R. K. Njiwa;X. Bourrat;J. Takadoum
通讯作者:
P. Stempfle;Olivier Pantalé;Toufik Djilali;R. K. Njiwa;X. Bourrat;J. Takadoum
影响因子:
4
作者:
Li, Yinwei;Wang, Mei;Cui, Tian;Ma, Yanming;Zou, Guangtian
通讯作者:
Zou, Guangtian
影响因子:
5.4
作者:
Wen, M.;Meng, Q. N.;Yu, W. X.;Zheng, W. T.;Mao, S. X.;Hua, M. J.
通讯作者:
Hua, M. J.
影响因子:
5.2
作者:
J. Chrzanowska;Ł. Kurpaska;M. Giżyński;J. Hoffman;Z. Szymański;T. Mościcki
通讯作者:
J. Chrzanowska;Ł. Kurpaska;M. Giżyński;J. Hoffman;Z. Szymański;T. Mościcki