Investigation of surface morphology and ion activation of aluminium implanted 4H-SiC

Investigation of surface morphology and ion activation of aluminium implanted 4H-SiC
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铝注入 4H-SiC 的表面形貌和离子活化研究

DOI:
10.1007/s11431-012-4827-4
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发表时间:
2012-04
影响因子:
4.6
通讯作者:
Tang XiaoYan
Tang XiaoYan
中科院分区:
工程技术2区
文献类型:
--
作者:
Song QingWen;Zhang YuMing;Zhang YiMen;Tang XiaoYan

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Multiple-energy aluminium (Al+) implantation into 4H-SiC (0001) epilayer and activation anneal with a graphite encapsulation layer were investigated in this paper. Measurements showed that the implanted Al+box doping profile was formed and a high ion activation ratio of 78% was achieved by 40 min annealing at 1600°C using a horizontal chemical vapor deposition (CVD) reactor. The step bunching effect associated with the high temperature post implantation activation annealing (PIA) process was dramatically suppressed by using the graphite encapsulation layer. And a flat and smooth surface with a small average surface roughness (RMS) value of around 1.16 nm was achieved for the implanted 4H-SiC after the PIA process. It was demonstrated that this surface protection technique is a quite effective process for 4H-SiC power devices fabrication.
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