Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization
Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization
复制标题
通过杂化调整填充电纺氧化铝纤维和石墨烯纳米片的环氧复合材料的热性能和介电性能
DOI:
10.1039/c5tc01552a
复制
发表时间:
2015-07
影响因子:
6.4
通讯作者:
Zhi-Min Dang
中科院分区:
文献类型:
--
作者:
Jun-Wei Zha;Tian-Xing Zhu;Yun-Hui Wu;Si-Jiao Wang;Robert K. Y. Li;Zhi-Min Dang
Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation. However, the low thermal conductivity and mismatched dielectric properties limit its application in highly integrated circuits. In this work, alumina fibers (AFs) were firstly prepared via electrospinning with sol–gel precursor. Epoxy (EP) composites with graphene nanoplatelets (GNPs) and AFs were fabricated using a hot-pressing process. Microstructures, thermal conductivity and dielectric properties of EP hybrid composites were studied. Scanning electron microscopy images reveal that the modified AFs and GNPs were uniformly dispersed in the epoxy matrix and the thermal conductive reticular structures were formed. The AFs can not only link the GNPs and epoxy but also reduce the interfacial thermal resistance so that a high thermal conductivity of 1.62 W m−1 K−1 is realized in the EP–GNP–AF composite, which is about 8 times higher than pure EP. The decomposition temperature of the epoxy composites with 2 vol% GNP and 50 vol% AF loading was enhanced by about 100 degrees. Dielectric properties of EP composites have a strong dependence on frequency and a weak dependence on temperature, which gives rise to the potential in different electronic/electrical field applications.
登录
查看更多内容
影响因子:
--
作者:
Tan CM;Baudot C;Han Y;Jing H
通讯作者:
Jing H
影响因子:
6
作者:
Yanfei Zhang;Jiayan Li;Qin Li;Ling Zhu;Xiangdong Liu;X. Zhong;J. Meng;Xueqiang Cao
通讯作者:
Yanfei Zhang;Jiayan Li;Qin Li;Ling Zhu;Xiangdong Liu;X. Zhong;J. Meng;Xueqiang Cao
影响因子:
4.6
作者:
Chung, Pao Tang;Yang, Chun Ting;Liu, Cheng-Yi
通讯作者:
Liu, Cheng-Yi
影响因子:
29.4
作者:
Song, Sung Ho;Park, Kwang Hyun;Jeon, Seokwoo
通讯作者:
Jeon, Seokwoo
影响因子:
4.5
作者:
Im, Hyungu;Kim, Jooheon
通讯作者:
Kim, Jooheon