On-machine measurement of a slow slide servo diamond-machined 3D microstructure with a curved substrate
On-machine measurement of a slow slide servo diamond-machined 3D microstructure with a curved substrate
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具有弯曲基底的慢滑动伺服金刚石加工 3D 微结构的机上测量
DOI：
10.1088/0957-0233/26/7/075003
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发表时间：
2015-06
影响因子：
2.4
通讯作者：
Sun, Anyu
中科院分区：
文献类型：
--
作者：
Yang, Shunyao;Ju, Bing-Feng;Jiang, Jiacheng;Sun, Anyu
基于扫描隧道显微镜的多轴测量系统是专门针对三维（3D）微结构的在机测量而开发的，以解决传统离线测量过程的质量控制困难。采用慢速滑动伺服技术对典型的曲面复眼三维微结构进行了金刚石加工，然后利用主轴、两个直线运动工作台和一个附加的旋转工作台，基于尖端跟踪策略对整个曲面进行了在机三维扫描。在机上精确测量了加工表面轮廓及其形状偏差。基于从测量表面提取的特征点，对曲面基底上成像的小眼的变形进行了区分评价。此外，加工误差与在机测量表面及其特征参数进行了研究。实验结果表明，该测量系统可实现曲面基片三维微结构的多功能在线测量，对加工领域的质量控制具有重要意义。
A scanning tunneling microscope-based multi-axis measuring system is specially developed for the on-machine measurement of three-dimensional (3D) microstructures, to address the quality control difficulty with the traditional off-line measurement process. A typical 3D microstructure of the curved compound eye was diamond-machined by the slow slide servo technique, and then the whole surface was on-machine scanned three-dimensionally based on the tip-tracking strategy by utilizing a spindle, two linear motion stages, and an additional rotary stage. The machined surface profile and its shape deviation were accurately measured on-machine. The distortion of imaged ommatidia on the curved substrate was distinctively evaluated based on the characterized points extracted from the measured surface. Furthermore, the machining errors were investigated in connection with the on-machine measured surface and its characteristic parameters. Through experiments, the proposed measurement system is demonstrated to feature versatile on-machine measurement of 3D microstructures with a curved substrate, which is highly meaningful for quality control in the fabrication field.
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影响因子：
8.6
作者：
G. Binning;H. Rohrer;C. Gerber;E. Weibel
通讯作者：
G. Binning;H. Rohrer;C. Gerber;E. Weibel
影响因子：
2.4
作者：
A. Weckenmann;A. Schuler;R. J. B. Ngassam
通讯作者：
A. Weckenmann;A. Schuler;R. J. B. Ngassam
影响因子：
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作者：
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通讯作者：
H. Suzuki;T. Onishi;T. Moriwaki;M. Fukuta;J. Sugawara
影响因子：
1.3
作者：
Zhang, Xiaodong;Fang, Fengzhou;Guo, Yuewu
通讯作者：
Guo, Yuewu
影响因子：
4.1
作者：
P. Pedone;E. Audrito;A. Balsamo
通讯作者：
P. Pedone;E. Audrito;A. Balsamo