Thermosetting polyimide resin matrix composites with interpenetrating polymer networks for precision foil resistor chips based on special mechanical performance requirements
Thermosetting polyimide resin matrix composites with interpenetrating polymer networks for precision foil resistor chips based on special mechanical performance requirements
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基于特殊机械性能要求的精密箔电阻片用互穿聚合物网络热固性聚酰亚胺树脂基复合材料
DOI：
10.1016/j.apsusc.2014.01.188
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发表时间：
2014-04
影响因子：
6.7
通讯作者：
H.X. Wang
中科院分区：
文献类型：
--
作者：
X.Y. Wang;J.X. Ma;C.G. Li;H.X. Wang
针对热固性聚酰亚胺(TSPI)树脂在保护精密箔电阻芯片时性能不佳的问题，在互穿网络(IPN)的基础上，选择了不同的高分子材料如环氧树脂、酚醛树脂和有机硅树脂对其进行改性。在综合考虑性能和工艺要求的基础上，采用固化阶段可控的共聚改性方法制备TSPI复合材料。针对钨针划痕边缘规整性的特殊要求，重点研究了与修边工艺相关的力学性能。对划痕边缘的分析表明，划痕引起的微裂纹的产生和扩展以及裂纹的闭合效应可能导致规则的划痕。实验表明，TSPI复合材料的断裂伸长率是决定其特殊力学性能的主要原因。理想的候选材料应具有适当的硬度和韧性，具体的力学数据为：聚合物材料的平均断裂伸长率和拉伸强度分别在9.2-10.4%和100-107兆帕之间。通过红外光谱和热重分析，探讨了不同改性剂对TSPI聚合物性能影响的可能原因、改性TSPI树脂的反应机理和TSPI复合聚合物中的IPN结构。
Based on interpenetrating networks (IPNs) different macromolecular materials such as epoxy, phenolic, and silicone resin were chosen to modify thermosetting polyimide (TSPI) resin to solve the lack of performance when used for protecting precision foil resistor chips. Copolymerization modification, controlled at curing stage, was used to prepare TSPI composites considering both performance and process requirements. The mechanical properties related to trimming process were mainly studied due to the special requirements of the regularity of scratch edges caused by a tungsten needle. The analysis on scratch edges reveals that the generation and propagation of microcracks caused by scratching together with crack closure effect may lead to regular scratch traces. Experiments show that the elongation at break of TSPI composites is the main reason that determines the special mechanical properties. The desired candidate materials should have proper hardness and toughness, and the specific mechanical data are that the mean elongation at break and tensile strength of polymer materials are in the range of 9.2–10.4% and 100–107 MPa, respectively. Possible reasons for the effect of the modifiers chosen on TSPI polymers, the reaction mechanisms on modified TSPI resin and the IPN structure in TSPI composite polymers were discussed based on IR and TG analysis.
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DOI：
--
发表时间：
1993-03
期刊：
--
影响因子：
--
作者：
M. I. Bessonov;V. Zubkov
通讯作者：
M. I. Bessonov;V. Zubkov
影响因子：
3
作者：
Pengchang Ma;W. Nie;Zheng Yang;Peihong Zhang;Gang Li;Q. Lei;Lian‐xun Gao;Xiangling Ji;M. Di
通讯作者：
Pengchang Ma;W. Nie;Zheng Yang;Peihong Zhang;Gang Li;Q. Lei;Lian‐xun Gao;Xiangling Ji;M. Di
DOI：
--
发表时间：
1967-10
期刊：
--
影响因子：
--
作者：
Henry L. Lee;Kristoffer Neville
通讯作者：
Henry L. Lee;Kristoffer Neville
影响因子：
4.4
作者：
I. Sava;S. Chisca;M. Brumǎ;G. Lisa
通讯作者：
I. Sava;S. Chisca;M. Brumǎ;G. Lisa
影响因子：
5.4
作者：
Xuexin Wang;Zhi-qiang Zhang;J. Shao;Tian Bai
通讯作者：
Xuexin Wang;Zhi-qiang Zhang;J. Shao;Tian Bai