Research on Fatigue Properties of Micron Scale Copper Bonding Wires
Research on Fatigue Properties of Micron Scale Copper Bonding Wires
复制标题
微米级铜键合线疲劳性能研究
DOI：
10.4028/www.scientific.net/kem.734.176
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发表时间：
2017-04
期刊：
影响因子：
--
通讯作者：
Ming Lei
中科院分区：
文献类型：
--
作者：
Zihua Zhao;Fengcai Qi;Shuang Zhao;Ming Lei
铜接合线经常用于连接到MEMS器件。铜线的力学性能对MEMS系统的可靠性至关重要。对微米级铜键合线进行了对称弯曲疲劳试验。该实验是基于微悬臂梁在直流电压作用下在两电极间产生自激振动的现象。结果表明，直径为20μm的铜丝的屈服强度、抗拉强度和杨氏模量均高于直径为30μm和40μm的铜丝，表现出明显的尺寸效应。在疲劳试验中，失效循环数为104~107。在相同应力条件下，直径为20μm、30μm、40μm的铜丝的疲劳强度（N=106）分别为140 MPa、97 MPa、70 MPa。拉伸断口为凿形峰，断口表面出现许多间隔开的条状拉伸痕迹。疲劳断口平整。两条裂纹几乎同时从表面起裂，最终破裂区呈窄板状。
Copper bonding wires are frequently used to connect to MEMS devices. Mechanical properties of copper wire are crucial to the reliability of MEMS system. The paper reported a symmetrical bending fatigue test on micron scale copper bonding wires. The test is based on the phenomenon that a micro-cantilever can be set into self-excited vibration between two electrodes under DC voltage. The results demonstrate that the yield strength, ultimate tensile strength and Young's modulus of copper wires with diameter of 20μm are higher than those with a diameter of 30μm and 40μm, which significantly performs size effect. In fatigue test, the number of cycles to failure is 104~107. Under the same stress condition, fatigue strength (N=106) of copper wires (d=20μm, 30μm, 40μm) is 140MPa, 97MPa, 70MPa respectively. The tensile fracture surface is the chisel-shaped peak, and the surface of the fracture appears many spaced strip drawing traces. The fatigue fracture surface is flat. Two cracks almost simultaneously originate from the surface, and the final rupture region is just like a narrow sheet.
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DOI：
10.1109/icept.2016.7583248
发表时间：
2016-08
期刊：
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
影响因子：
--
作者：
J. Wen;Yanhong Tian
通讯作者：
J. Wen;Yanhong Tian
DOI：
10.1016/j.microrel.2012.06.081
发表时间：
2012-09
期刊：
Microelectron. Reliab.
影响因子：
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作者：
B. Czerny;M. Lederer;B. Nagl;Alexander Trnka;G. Khatibi;M. Thoben
通讯作者：
B. Czerny;M. Lederer;B. Nagl;Alexander Trnka;G. Khatibi;M. Thoben
影响因子：
6
作者：
Stanzl-Tschegg, Stefanie;Mughrabi, Hael;Schoenbauer, Bernd
通讯作者：
Schoenbauer, Bernd
DOI：
10.1063/1.4898668
发表时间：
2014-10
期刊：
The Review of scientific instruments
影响因子：
--
作者：
Mingjing Qi;Zhiwei Liu;Xiaojun Yan
通讯作者：
Mingjing Qi;Zhiwei Liu;Xiaojun Yan
DOI：
10.4028/www.scientific.net/amr.264-265.108
发表时间：
2011-06
期刊：
Advanced Materials Research
影响因子：
--
作者：
You Huang;Yao-Min Chang
通讯作者：
You Huang;Yao-Min Chang