Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
复制标题
动态液冷降低泵浦功率控制策略的设计与优化
DOI:
10.1115/1.4049018
复制
发表时间:
2021
影响因子:
1.6
通讯作者:
Agonafer, Dereje
中科院分区:
文献类型:
--
作者:
Kasukurthy, Rajesh;Rachakonda, Amruthavalli;Agonafer, Dereje
Data centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on thermal engineers to develop efficient methods in order to minimize the expenditure at least toward cooling considering the limited available power resources. One of the key areas where electronic cooling research has been focusing, is addressing the issue of nonuniform power distribution at the rack, server and even at package levels. Nonuniform heating at the chip level creates hotspots and temperature gradients across the chip which in turn significantly increases the cost of cooling, as cooling cost is a function of the maximum junction temperature. This challenge has increased the use of temperature sensing mechanisms to help in finding ways to mitigate the gradients. A very effective way to conserve pumping power and address hotspots on the single or multichip modules is by targeted delivery of liquid coolant. One way to enable such targeted delivery of coolant is by using dynamic cold plates coupled with self-regulating flow control device that can control flow rate based on temperature. This novel technology will have more effective implementation coupled with a good control strategy. This paper addresses the development and testing of such control strategy with minimal sensors along with less latency and optimization of the same.
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DOI:
10.1109/itherm.2018.8419503
发表时间:
2018
期刊:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
影响因子:
--
作者:
Kasukurthy, R;Challa, P;Palanikumar, R;Manimaran, B;Agonafer, D
通讯作者:
Agonafer, D
影响因子:
1.6
作者:
Shah, Jimil M.;Eiland, Richard;Rajmane, Pavan;Siddarth, Ashwin;Agonafer, Dereje;Mulay, Veerendra
通讯作者:
Mulay, Veerendra
DOI:
10.1115/ipack2017-74028
发表时间:
2017
期刊:
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
影响因子:
--
作者:
Chowdhury, Uschas;Sahini, Manasa;Siddarth, Ashwin;Agonafer, Dereje;Branton, Steve
通讯作者:
Branton, Steve
DOI:
--
发表时间:
2014
期刊:
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
影响因子:
--
作者:
R. Eiland;J. Fernandes;M. Vallejo;D. Agonafer;V. Mulay
通讯作者:
V. Mulay
DOI:
10.1016/s1369-7021(03)01047-2
发表时间:
2022
期刊:
Encyclopedia of Big Data
影响因子:
--
作者:
M. Hogan
通讯作者:
M. Hogan