An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition
An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition
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通过聚多巴胺功能化和无电沉积在聚苯醚基底上制造高性能铜层的可行策略
DOI：
10.1007/s10854-022-08243-4
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发表时间：
2022-04
期刊：
影响因子：
--
通讯作者：
Yan Wang
中科院分区：
文献类型：
--
作者：
Hui-gen Liu;Zhe-sheng Feng;Kang Wang;Ji-qing Lian;Yuan-ming Chen;Meng-yao Yang;Yan Wang
介绍了一种简单有效的方法，通过化学沉积在聚苯醚（PPO）基板上制备高性能铜层，用于高频电路板。首先，通过KMnO 4和KOH的组合进行微化学蚀刻后，在PPO基底的表面上成功地形成聚多巴胺涂层。由于多巴胺的亲水性和附着力强，银离子被均匀地吸附在PPO基体上，作为化学镀铜的催化剂。通过光学显微镜、SEM、EDS、XRD等测试手段，对镀层进行了表征。沉积铜层的电阻约为2.74 μΩ cm（仅为铜形铜电阻的1.68倍），100格剥离测试后，铜层的附着力也达到ASTM D3559标准中的5B评分。该技术为在PPO基底上制备高性能铜层提供了一种可靠的方法，该方法在功能电子学，包括工业聚合物电路和器件中具有很大的应用潜力。
A facile and effective approach to fabricate a high-performance copper layer on polyphenylene oxide (PPO) substrate via electroless deposition for applications in the high-frequency circuit board is introduced in this study. Initially, a polydopamine coating was successfully formed on the surface of the PPO substrate after a micro-chemical etching by the combination of KMnO4and KOH. Due to the high hydrophilic and strong adhesion of dopamine, the silver ions were uniformly adsorbed on the PPO substrate as a catalyst of electroless copper plating. Consequently, a metal copper layer with high reliability and strong adhesion is formed, which is characterized by optical microscopy, SEM, EDS, and XRD. The resistance of the deposited copper layer was about 2.74 μΩ cm (only block 1.68 times the resistance of copper-shaped copper), and the adhesion of the copper layer also reached the 5B score in the ASTM D3559 standard after the 100-grid peel test. This technique offers a dependable method to prepare a high-performance copper layer on the PPO substrate which has a great potential to be applied in functional electronics, including industrial polymer circuits and devices.
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