Enhanced defect annihilation capability of the graphene/copper interface: An in situ study
Enhanced defect annihilation capability of the graphene/copper interface: An in situ study
复制标题
石墨烯/铜界面增强的缺陷消除能力：原位研究
DOI：
10.1016/j.scriptamat.2021.114001
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发表时间：
2021-10
影响因子：
6
通讯作者：
Reza Namakian
中科院分区：
文献类型：
--
作者：
Kunming Yang;Pengzheng Tang;Qi Zhang;Houyu Ma;Enqing Liu;Meimei Li;Xinghang Zhang;Jin Li;Yue Liu;Tongxiang Fan;Reza Namakian
众所周知，高能重离子照射通常会诱发缺陷并最终导致材料降解。界面，如大角度晶界（HAGB），通常被用作缺陷汇，以减轻辐照损伤。然而，HAGB在辐射过程中往往不稳定。在透射电子显微镜下研究了原位Kr ++离子辐照石墨烯（Gr）/Cu复合材料的界面辐照响应。结果表明，Gr/Cu界面具有更高的缺陷湮没能力相比，在Cu的HAGB。此外，原子模拟表明，Gr/Cu界面的应力场略高和较大的范围，这有助于增强缺陷吸收能力。目前的研究结果是必不可少的理解和设计一类新的碳/金属复合材料具有上级耐辐照。
It is well known that energetic heavy ion irradiations can often induce defects and ultimately lead to material degradations. Interfaces, such as high-angle grain boundaries (HAGBs), are generally used as defect sinks for alleviating the irradiation damage. However, HAGBs are often unstable during radiation. Here we investigate the interfacial irradiation responses of the graphene (Gr)/Cu composites by usingin situKr++ions irradiation under transmission electron microscopy. The results revealed that the Gr/Cu interface exhibits higher defect annihilation capability compared to the HAGBs in Cu. Moreover, the atomistic simulations suggested a slightly higher and larger range of stress field for the Gr/Cu interface, which contributes to the enhanced defects absorption capability. The present findings are essential to understand and design a new class of carbon/metal composites with superior irradiation tolerance.
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影响因子：
10.8
作者：
Li, J.;Yu, K. Y.;Zhang, X.
通讯作者：
Zhang, X.
DOI：
10.1007/s11661-013-1635-9
发表时间：
2013-02
期刊：
Metallurgical and Materials Transactions A
影响因子：
--
作者：
Chengshuai Sun;M. Song;K. Yu;Youxing Chen;M. Kirk;Meimei Li;Haiyan Wang;Xinghang Zhang
通讯作者：
Chengshuai Sun;M. Song;K. Yu;Youxing Chen;M. Kirk;Meimei Li;Haiyan Wang;Xinghang Zhang
影响因子：
9.4
作者：
Cheng Sun;B. Uberuaga;L. Yin;Jin Li;Youxing Chen;M. Kirk;Meimei Li;S. Maloy;H. Wang;
通讯作者：
Cheng Sun;B. Uberuaga;L. Yin;Jin Li;Youxing Chen;M. Kirk;Meimei Li;S. Maloy;H. Wang;
交叉累积辊压接合制备块状铜/钽纳米层状多层膜的高强度和热稳定性
影响因子：
9.4
作者：
Zeng, L. F.;Gao, R.;Zhang, T.
通讯作者：
Zhang, T.
影响因子：
16.6
作者：
K. Yu;D. Bufford;Chengshuai Sun;Yue Liu;Haiyan Wang;M. Kirk;Matthew Li;Xinghang Zhang
通讯作者：
K. Yu;D. Bufford;Chengshuai Sun;Yue Liu;Haiyan Wang;M. Kirk;Matthew Li;Xinghang Zhang