Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique
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基于 X 射线衍射技术的 Sn-Ag-Cu 焊点电迁移引起的应力演化研究

DOI:
10.1007/s11664-011-1837-0
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发表时间:
2012-02
影响因子:
2.1
通讯作者:
Zhao, Haiyan
Zhao, Haiyan
中科院分区:
工程技术4区
文献类型:
--
作者:
Ma, Limin;Guo, Fu;Xu, Guangchen;Wang, Xitao;He, Hongwen;Zhao, Haiyan

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焊点承受的临界电流密度和温度被确定为决定电迁移(EM)发生的两个最重要的参数。众所周知,在电流应力作用下,金属原子/离子的运动会在焊点的阳极和阴极界面处引起明显的应力集中。因此,在阳极和阴极界面上的应力演化的EM的全球平均效应进行了研究,通过采用非破坏性的X射线衍射技术与不同的电流密度。结果表明,在低电流密度下,阳极侧压应力逐渐增大。然而,由于明显的焦耳热效应,在高电流密度下可以观察到应力波动。为了进一步理解电流应力作用下焊点应力演化的机理,本文提出了一个四阶段模型。首先,Cu膨胀导致两个电极处的压应力增加。第二,应力松弛补偿了压应力,使其减小。第三,EM效应分别促进阳极和阴极处的压应力和张应力。最后,在阳极处实现应力的稳定状态,而在阴极处的拉伸应力的状态保持瞬态。
The critical current density and temperature endured by solder joints are identified as the two most important parameters that determine the occurrence of electromigration (EM). It is well known that movement of metal atoms/ions during current stressing can induce obvious stress concentrations at the anode and cathode interfaces of the solder joint. Therefore, the global average effects of EM on stress evolution at both the anode and cathode interfaces were investigated with different current densities by employing a nondestructive x-ray diffraction technique. The ultimate results indicated that the compressive stress increased gradually at the anode side under low current density. However, stress fluctuation could be observed under high current density due to an obvious Joule heating effect. For further understanding of the mechanism of stress evolution in the solder joint during current stressing, a four-stage model is considered. First, Cu expansion led to increase of the compressive stress at both electrodes. Second, stress relaxation compensated the compressive stress and caused it to decrease. Third, the EM effect promoted compressive stress and tensile stress at the anode and cathode, respectively. Finally, a steady state of stress was achieved at the anode, while the state of tensile stress at the cathode remained transient.
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