Elucidation of material removal mechanism in float polishing
Elucidation of material removal mechanism in float polishing
复制标题
浮法抛光材料去除机理的阐明
DOI：
10.1016/j.precisioneng.2021.10.004
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发表时间：
2021
期刊：
影响因子：
--
通讯作者：
Y. Namba
中科院分区：
文献类型：
--
作者：
A. T. H. Beaucamp;K. Nagai;M. Okada;H. Suzuki;Y. Namba
浮动抛光（FP）是一种非接触式抛光方法，它利用流体动压效应在工件和精密研磨盘之间保持一薄层流体。虽然已知可持续地产生原子级平坦表面而几乎没有或没有亚表面损伤，但尚未深入研究抛光流体流动和材料去除的特性。本研究利用计算流体力学（CFD）和分子动力学（MD）模拟的方法，探讨了FP的基本机理。结果表明，由于浆体的楔效应，在流场中产生了一个几微米高的流体间隙。通过对空化泡的直接观察和跟踪，进一步研究了近壁流动条件。磨粒轨迹跟踪进行了良好校准的CFD模型，并表明，单个磨粒移动几乎平行于工件表面的相对速度约为0.5 mm/s。接下来，通过MD模拟单个磨料颗粒与Ni晶体表面的相互作用，以预测有效平滑表面的动能方面所需的条件。最后，它的结论是，在FP的材料去除机制是依赖于最小尺寸的纳米磨料团聚体的几个100 nm，并存在两种类型的平滑现象：原子去除和原子转移。
Float polishing (FP) is a non-contact polishing method in which a thin layer of fluid is maintained between the workpiece and precision lap by hydrodynamic pressure effect. While it is known to consistently produce atomically flat surfaces with little or no sub-surface damage, the characteristics of polishing fluid flow and material removal have not been studied in-depth. In this research, the underlying mechanism in FP is investigated by means of computational fluid dynamics (CFD) and molecular dynamics (MD) simulation. It is revealed that a fluid gap few microns in height is generated by the wedge effect of slurry. The near wall flow condition is further investigated by direct observation and tracing of cavitation bubbles. Abrasive particle trajectory tracing is carried out with a well calibrated CFD model, and suggests that single abrasive particles move almost parallel to the workpiece surface at a relative speed of around 0.5 mm/s. Next, single abrasive particle interactions with the surface of a Ni crystal are simulated by MD to predict the required conditions in terms of kinetic energy for effective smoothing of the surface. Finally, it is concluded that the material removal mechanism in FP is dependent on a minimum size of nano-abrasive agglomerates of several 100 nm, and the existence of two types of smoothing phenomena: atomic removal and atomic transfer.
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影响因子：
4.1
作者：
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通讯作者：
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DOI：
10.11522/pscjspe.2019a.0_56
发表时间：
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期刊：
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影响因子：
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影响因子：
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作者：
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DOI：
--
发表时间：
2002
期刊：
Proc.17th Annual Meeting of ASPE
影响因子：
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作者：
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通讯作者：
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