Anisotropic thermal conductivity and associated heat transport mechanism in roll-to-roll graphene reinforced copper matrix composites
Anisotropic thermal conductivity and associated heat transport mechanism in roll-to-roll graphene reinforced copper matrix composites
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卷对卷石墨烯增强铜基复合材料中的各向异性导热率和相关热传输机制
DOI：
10.1016/j.actamat.2020.07.021
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发表时间：
2020-09
期刊：
影响因子：
9.4
通讯作者：
Tongxiang Fan
中科院分区：
文献类型：
--
作者：
Kunming Yang;Youcao Ma;Zhongyin Zhang;Jie Zhu;Zhibo Sun;Jinsong Chen;Haohao Zhao;Jian Song;Quan Li;Naiqi Chen;Houyu Ma;Jia Zhou;Yue Liu;Tongxiang Fan
由于铜（Cu）的高强度和石墨烯（Gr）的高面内导热率（Kr），Gr/Cu复合材料作为确保散热的先进热管理材料的需求越来越大。传热性能主要受两个方面的影响：（1）Gr的本征参数，包括其结晶度、层数（N）、覆盖度和空间分布；（2）Gr/Cu界面相关特性，如界面结合、残余应变和界面附近的缺陷。在这项工作中，通过结合卷对卷（R2R）化学气相沉积（CVD）和随后的热等静压（HIP）技术，制备了具有可控N的高度平行的Gr增强铜基复合材料。实验结果表明，~5-6L Gr/Cu 复合材料表现出最高程度的各向异性，包括（1）最高的 Kr（394 ± 5 W/mK，比纯 Cu 对应物高约 22%），以及（2）最低的贯通面热导率 (Kz)（257 ± 4 W/mK，比纯 Cu 对应物低约 25%）。当N从1变化到5时，不断增加的Krand减少Kza主要受Gr的本征特性影响，这也被多尺度模拟和时域热反射分析所验证。当N增加到~10时，Kr和Kze都表现出相反的趋势，这可能归因于Gr覆盖率降低和无定形碳体积分数增大。此外，界面处的残余应变和缺陷可以很好地降低Kr和Kzas。这项研究表明，高结晶度厚 Gr 的先进合成可能有望获得优质的 Krin Cu 基复合材料。
Owing to the high strength of copper (Cu) and high in-plane thermal conductivity (Kr) of graphene (Gr), Gr/Cu composites are increasingly demanded as the advanced thermal management materials to ensure the heat dissipation. The heat transport performance is primarily influenced by two aspects: (1) Intrinsic parameters of Gr, including its crystallinity, layer number (N), coverage and spatial distribution and (2) Gr/Cu interface related properties, such as interface bonding, residual strain and defects near the interface. In this work, by combining roll-to-roll (R2R) chemical vapor deposition (CVD) and subsequent hot isostatic pressing (HIP) techniques, highly paralleled Gr reinforced Cu matrix composites with controllableNwere fabricated. Experimental results show that ~5–6L Gr/Cu composites manifest the highest degree of anisotropy, including (1) the highestKr(394 ± 5 W/mK, ~22% higher than pure Cu counterpart), and (2) the lowest through-plane thermal conductivity (Kz) (257 ± 4 W/mK, ~25% lower than pure Cu counterpart). WhenNvaries from 1 to 5, the continuously increasedKrand decreasedKzare majority influenced by intrinsic properties of Gr, which is also validated by multiscale simulations and time-domain thermoreflectance analysis. WhenNincreases to ~10, bothKrandKzexhibit opposite trend, that may attribute to the reduced Gr coverage and large volume fraction of amorphous carbon. Moreover, the residual strain and defects at the interface could lower bothKrandKzas well. This study suggests that advanced synthesis of high-crystallinity thick Gr may be promising to obtain superbKrin Cu matrix composites.
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