Theoretical model of warping deformation during self-rotating grinding of YAG wafers
Theoretical model of warping deformation during self-rotating grinding of YAG wafers
复制标题
YAG晶片自转磨削翘曲变形的理论模型
DOI：
10.1016/j.ceramint.2021.10.250
复制
发表时间：
2021-11
影响因子：
5.2
通讯作者：
Feihu Zhang
中科院分区：
文献类型：
--
作者：
Chen Li;Yuxiu Hu;Shuqiang Huang;Binbin Meng;Yinchuan Piao;Feihu Zhang
YAG晶片是高功率激光器中使用最多的激光晶体，通常通过磨削来加工，以满足激光元件的要求精度。由残余应力引起的翘曲变形是研磨过程中产生的主要损伤之一，严重降低了激光器的使用精度和寿命。建立翘曲变形理论模型对实现YAG晶圆的超精密加工具有重要意义。从磨料的运动轨迹、脆韧转变、弹性力学、砂轮弹性变形和应变率效应等方面研究了自旋转磨削单颗磨料的切削量和磨削力。建立了基于切深和磨削力的自旋转磨削加工翘曲变形的理论模型。在理论模型和有限元模拟的基础上，分析了次表面损伤和残余应力对翘曲变形的影响。结果表明，翘曲变形随砂轮转速的增大而减小，随磨粒尺寸、工件转速和进给速度的增大而增大。实验结果与理论模型的模拟结果吻合较好，表明理论模型能够较准确地预测自转磨削过程中的翘曲变形。这项工作不仅可以加深对超精密加工引起晶圆翘曲本质的认识，而且可以为优化自旋转磨削加工工艺参数提供指导。
YAG wafers are the most host laser crystals used for high-power lasers, which are usually machined by grinding to meet the required accuracy for laser components. Warping deformation induced by the residual stress is one of the main damages for YAG wafers after the grinding process, which will seriously decrease the service accuracy and life of the lasers. Developing theoretical model of warping deformation is of great significance to achieving the ultra-precision machining of YAG wafers. The cutting depth of single abrasive and grinding force in self-rotating grinding were investigated by considering the kinematic trajectory of abrasives, brittle-to-ductile transition, elastic mechanics, elastic deformation of the grinding wheel and strain rate effect. A theoretical model of warping deformation in self-rotating grinding of YAG wafers was developed based on the cutting depth and grinding force. The influence of subsurface damage and residual stress on warping deformation was analyzed based on the theoretical model and finite element simulation. Self-rotating grinding tests of YAG wafers were performed, and the results showed that the warping deformation decreased as the wheel rotational speed increased, and increased as the abrasive size, workpiece rotational speed and feed speed increased. The experimental results agreed well with the simulated results of the theoretical model, indicating that the theoretical model can accurately predict the warping deformation induced by self-rotating grinding process. This work will not only enhance the understanding of the essence of the wafer warping induced by ultra-precision machining, but also provide a guide for optimizing the processing parameters in self-rotating grinding of YAG wafers.
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