Self-assembly of three-dimensional prestressed tensegrity structures from DNA.
Self-assembly of three-dimensional prestressed tensegrity structures from DNA.
复制标题
DOI：
10.1038/nnano.2010.107
复制
发表时间：
2010-07
影响因子：
38.3
通讯作者：
中科院分区：
文献类型：
--
作者：
张拉整体或张拉完整性是结构的一种特性，它的稳定性依赖于纯压缩或纯拉伸组件之间的平衡。张拉整体结构具有极高的强度重量比和巨大的回弹性，因此被广泛应用于工程、机器人和建筑领域。在这里，我们报告了纳米级，预应力，三维张拉整体结构，其中刚性的DNA双螺旋束抵抗单链DNA片段施加的压缩力，单链DNA片段作为张力承载电缆。我们的DNA张拉整体结构可以在高达14 pN的力下自组装，这是强大的分子马达（如运动蛋白或肌球蛋白）失速力的两倍。由这种分子预应力机制产生的力可以用来弯曲DNA束或通过酶在特定位点的裂解来驱动整个结构。除了作为纳米结构的基石外，单链DNA构成的拉伸结构元件还可以用于研究分子力、细胞机械转导和其他基本生物过程。
Tensegrity or tensional integrity is a property of a structure that relies on a balance between components that are either in pure compression or in pure tension for its stability. Tensegrity structures exhibit extremely high strength-to-weight ratios and great resilience, and are therefore widely used in engineering, robotics and architecture. Here we report nanoscale, prestressed, three-dimensional tensegrity structures in which rigid bundles of DNA double helices resist compressive forces exerted by segments of single-stranded DNA that act as tension-bearing cables. Our DNA tensegrity structures can self-assemble against forces up to 14 pN, which is twice the stall force of powerful molecular motors such as kinesin or myosin. The forces generated by this molecular prestressing mechanism can be employed to bend the DNA bundles or to actuate the entire structure through enzymatic cleavage at specific sites. In addition to being building blocks for nanostructures, tensile structural elements made of single-stranded DNA could be used to study molecular forces, cellular mechanotransduction, and other fundamental biological processes.
登录
查看更多内容
影响因子：
15
作者：
Liu, D;Wang, MS;Mao, CD
通讯作者：
Mao, CD
影响因子：
64.8
作者：
Visscher, K;Schnitzer, MJ;Block, SM
通讯作者：
Block, SM
影响因子：
14.9
作者：
Douglas SM;Marblestone AH;Teerapittayanon S;Vazquez A;Church GM;Shih WM
通讯作者：
Shih WM
影响因子：
64.8
作者：
Douglas, Shawn M.;Dietz, Hendrik;Liedl, Tim;Hoegberg, Bjoern;Graf, Franziska;Shih, William M.
通讯作者：
Shih, William M.
影响因子：
3.4
作者：
Clemen, AEM;Vilfan, M;Rief, M
通讯作者：
Rief, M