Subgrain rotation at twin grain boundaries of a lead-free solder joint during thermal shock
Subgrain rotation at twin grain boundaries of a lead-free solder joint during thermal shock
复制标题
热冲击期间无铅焊点双晶界处的亚晶粒旋转
DOI：
10.1007/s10854-016-5022-3
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发表时间：
2016-05
影响因子：
2.8
通讯作者：
Guo Fu
中科院分区：
文献类型：
--
作者：
Tan Shihai;Han Jing;Guo Fu
对具有横截面边缘行的球栅阵列样品进行热冲击，以研究无铅焊点中再结晶区域的亚晶旋转。使用扫描电子显微镜 (SEM) 和电子背散射衍射来获得锡晶粒或亚晶粒在回流和热冲击条件下的微观结构和取向。定向成像显微镜显示，由于孪晶晶热膨胀系数高度失配，经过 200 次热冲击后，在倾斜的孪晶晶界处形成了多个亚晶粒。选取焊点中的四个亚晶粒并将其分为两部分，研究无铅焊点中的晶粒旋转行为。亚晶旋转分析表明，200次热震后局部再结晶过程中，亚晶旋转有3种方式，分别围绕Sn[100]、[101]和[110]轴旋转。存在(010)[]、(101)[010]和(110)[]三个滑移系与亚晶绕Sn[100]、[101]和[110]轴的旋转密切相关，因此亚晶旋转的三种方式都是可能的。此外，SEM显示，经过200次热冲击后，由于未再结晶区域和亚晶之间的取向差角不同，接头顶部产生了凹形区域。
A ball grid array specimen with cross sectioned edge row was thermally shocked to investigate subgrain rotation of recrystallized region in lead-free solder joints. Scanning electron microscopy (SEM) and electron backscattered diffraction were used to obtain the microstructure and orientations of Sn grains or subgrains in as-reflowed and thermally shocked conditions. Orientation imaging microscopy showed that several subgrains were formed at the tilted twin grain boundaries after 200 thermal shocks due to high mismatched coefficient of thermal expansion of twin grains. And four subgrains in the solder joint were selected and divided into two parts to research the grain rotation behavior in lead-free solder joint. The analysis of subgrain rotation indicated that there were three ways of subgrain rotation during localized recrystallization after 200 thermal shocks, which were about the Sn [100], [101] and [110] axes. There were three slip systems (010)[], (101)[010] and (110)[] which closely related with the subgrain rotation about Sn [100], [101] and [110] axes, so the three ways of subgrain rotation were possible. Furthermore, SEM showed that a concave region was generated at the top of the joint after 200 thermal shocks due to the different misorientation angles between nonrecrystallized region and subgrains.
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发表时间：
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影响因子：
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发表时间：
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影响因子：
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