Effect of surface area of grain boundaries on stress relaxation behavior in pure copper over wide range of grain sizes
Effect of surface area of grain boundaries on stress relaxation behavior in pure copper over wide range of grain sizes
复制标题
晶界表面积对宽范围晶粒尺寸纯铜应力松弛行为的影响
DOI：
10.1016/j.msea.2020.139585
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
Suzuki Shinsuke
中科院分区：
文献类型：
--
作者：
Suzuki Yurina;Ueno Kota;Murasawa Kodai;Kusuda Yoshinori;Takamura Masato;Hakoyama Tomoyuki;Hama Takayuki;Suzuki Shinsuke
本研究的目的是调查的晶界上的应力松弛行为在很宽的晶粒尺寸范围内的表面积的效果。使用单晶（SC）、粗晶（CG）和超细晶（UFG）样品进行应力松弛测试。此外，使用纯铜来消除固溶体和沉淀物的影响。使用应变保持开始后0.2s的应力松弛速率来研究初始应力松弛行为。此外，内部应力作为应力松弛行为的终点进行了研究。应力松弛速率随单位体积晶界表面积的增大而增大。虽然UFG样品的活化体积小于CG样品的活化体积，但应力松弛速率较高。这表明晶界滑动有助于UFG样品的应力降低。因此，即使发生晶界滑动，应力松弛速率也随着SV的增加而增加。除SC试样外，内应力随SV的增大而增大。此外，在CG范围内，内部应力可以近似为Hall-Petch（H-P）关系，其系数几乎等于流动应力的系数。内应力的这种行为内在地解释了H-P关系中假设的位错堆积模型。UFG样品的内应力降低到低于基于H-P关系的预期值。这表明位错源的耗尽阻止了内应力的增加。
The objective of this study was to investigate the effect of the surface area of grain boundaries on the stress relaxation behavior over a wide range of grain sizes. Stress relaxation tests were performed using single crystal (SC), coarse grained (CG), and ultra-fine grained (UFG) samples. Additionally, pure copper was used to eliminate the effects of the solid solution and precipitates. The initial stress relaxation behavior was investigated using the stress relaxation rate at 0.2 s after the beginning of strain holding. Furthermore, the internal stress was investigated as the end of the stress relaxation behavior. The stress relaxation rate increased with the surface area of the grain boundaries per unit volume (SV). Although the activation volume of the UFG sample was smaller than that of the CG samples, the stress relaxation rate was higher. This suggested that the grain boundary sliding contributed to the stress reduction of the UFG sample. Therefore, the stress relaxation rate increased withSVeven if grain boundary sliding occurred. The internal stress increased withSV, except for the SC sample. Furthermore, in the CG range, the internal stress could be approximated by the Hall-Petch (H-P) relation with a coefficient almost equal to that of the flow stress. This behavior of internal stress inherently explains the dislocation pile-up model assumed in the H-P relation. The internal stress of the UFG sample decreased below the expected value based on the H-P relation. It is suggested that the depletion of dislocation sources prevented the internal stress from increasing.
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