Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass.
Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass.
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DOI：
10.1038/s41598-023-32044-2
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发表时间：
2023-03-28
影响因子：
4.6
通讯作者：
Claypole, Tim
中科院分区：
文献类型：
--
作者：
Abbas, Bahaa;Jewell, Eifion;Lau, Yin Cheung;Searle, Justin;Claypole, Tim
铜有可能在印刷电子电路中作为银的一种具有成本效益的替代品，在医疗保健、太阳能、物联网设备和汽车应用中有多种应用。铜面临的主要挑战是它在烧结过程中容易氧化成不导电状态。光子烧结提供了一种克服氧化的方法，通过这种方法可以从离散的纳米微粒子迅速转化为完全或部分烧结的产物。在FTO镀膜玻璃上进行了混合纳米铜和混合纳米/微铜厚膜丝网印刷结构的闪光灯烧结实验研究。结果表明，可能存在多个能量窗口，可以成功地烧结厚膜铜印，防止有害的铜氧化。在最佳条件下，在1 s内获得的电导率为（3.11-4.3 × 10-7 Ω m），与在250°C还原气条件下90分钟获得的电导率相当，显著提高了生产率并降低了能源需求。同时也表现出良好的薄膜稳定性，100n材料的线电阻增加14%，50N50M墨水的线电阻增加10%左右，20N80M墨水的线电阻仅增加2%左右。
Copper potentially provides a cost-effective replacement for silver in printed electronic circuitry with diverse applications in healthcare, solar energy, IOT devices and automotive applications. The primary challenge facing copper is that it readily oxidizes to its non-conductive state during the sintering process. Photonic sintering offers a means of overcoming the oxidation by which rapid conversion from discrete nano-micro particles to fully or partially sintered products occurs. An experimental study of flash lamp sintering of mixed nano copper and mixed nano/ micro copper thick film screen printed structures on FTO coated glass was carried out. It shows that there may be multiple energy windows which can successfully sinter the thick film copper print preventing detrimental copper oxidation. Under optimum conditions, the conductivities achieved in under 1 s was (3.11–4.3 × 10–7 Ω m) matched those achieved in 90 min at 250 °C under reducing gas conditions, offering a significant improvement in productivity and reduced energy demand. Also present a good film stability of a 14% increase in line resistance of 100 N material, around 10% for the 50N50M ink and only around 2% for the 20N80M.
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