Physical and chemical imaging of adhesive interfaces with soft X-rays
Physical and chemical imaging of adhesive interfaces with soft X-rays
复制标题
用软 X 射线对粘合界面进行物理和化学成像
DOI:
10.1038/s43246-021-00168-5
复制
发表时间:
2021
影响因子:
7.8
通讯作者:
Takaki Hatsui
中科院分区:
文献类型:
--
作者:
Hiroyuki Yamane;Masaki Oura;Osamu Takahashi;Tomoko Ishihara;Noriko Yamazaki;Koichi Hasegawa;Tetsuya Ishikawa;Kiyoka Takagi;Takaki Hatsui
Adhesion is an interfacial phenomenon that is critical for assembling carbon structural composites for next-generation aircraft and automobiles. However, there is limited understanding of adhesion on the molecular level because of the difficulty in revealing the individual bonding factors. Here, using soft X-ray spectromicroscopy we show the physical and chemical states of an adhesive interface composed of a thermosetting polymer of 4, 4’-diaminodiphenylsulfone-cured bisphenol A diglycidyl ether adhered to a thermoplastic polymer of plasma-treated polyetheretherketone. We observe multiscale phenomena in the adhesion mechanisms, including sub-mm complex interface structure, sub-μm distribution of the functional groups, and molecular-level covalent-bond formation. These results provide a benchmark for further research to examine how physical and chemical states correlate with adhesion, and demonstrate that soft X-ray imaging is a promising approach for visualizing the physical and chemical states at adhesive interfaces from the sub-mm level to the molecular level.
登录
查看更多内容
影响因子:
4
作者:
F. Awaja;D. Mckenzie;Shengnan Zhang;N. James
通讯作者:
N. James
DOI:
10.1063/1.1757769
发表时间:
2004
期刊:
--
影响因子:
--
作者:
K. Shirasawa;T. Tanaka;T. Seike;A. Hiraya;H. Kitamura
通讯作者:
H. Kitamura
影响因子:
8.6
作者:
C. Keller;M. Stichler;G. Comelli;F. Esch;S. Lizzit;W. Wurth;D. Menzel
通讯作者:
D. Menzel
DOI:
10.1063/1.2436113
发表时间:
2007
期刊:
Katharsis
影响因子:
--
作者:
H. Ohashi;Y. Senba;H. Kishimoto;T. Miura;E. Ishiguro;T. Takeuchi;M. Oura;K. Shirasawa;Takashi Tanaka;M. Takeuchi;K. Takeshita;S. Goto;S. Takahashi;H. Aoyagi;M. Sano;Y. Furukawa;T. Ohata;T. Matsushita;Y. Ishizawa;S. Taniguchi;Y. Asano;Y. Harada;T. Tokushima;K. Horiba;H. Kitamura;T. Ishikawa;Shik Shin
通讯作者:
Shik Shin
影响因子:
1.9
作者:
H. Yamane;M. Oura;K. Sawada;T. Ebisu;T. Ishikawa;N. Yamazaki;K. Hasegawa;K. Takagi;T. Hatsui
通讯作者:
T. Hatsui