Dry sliding tribological behavior of nanocrystalline and conventional polycrystalline copper

Dry sliding tribological behavior of nanocrystalline and conventional polycrystalline copper
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纳米晶铜和传统多晶铜的干滑动摩擦学行为

DOI:
10.1007/s11249-005-9007-2
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发表时间:
2006-01
期刊:
影响因子:
3.2
通讯作者:
--
中科院分区:
工程技术2区
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--
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采用以硬质合金球为摩擦面的球盘式摩擦计,研究了电沉积纳米晶铜(nc Cu)和传统粗晶铜(cg Cu)的干滑动摩擦行为。实验结果表明,纳米晶铜的耐磨性比粗晶铜的耐磨性提高。当载荷低于20 n时,nc Cu的稳态摩擦系数明显低于cg Cu,在5 ~ 40 n的载荷范围内,nc Cu的磨损体积始终低于cg Cu,随着载荷的增大,nc Cu与cg Cu的耐磨性差异减小。cnc Cu的磨损性能的增强与纳米晶结构的高硬度和低加工硬化率有关,并且易于被磨损碎屑氧化,这与晶粒细化有关。
Dry sliding tribological behavior of an electro-deposited nanocrystalline Cu (nc Cu) and a conventional coarse-grained Cu (cg Cu) has been investigated using a ball-on-disc tribometer with cemented tungsten carbide ball as the counterface. Experimental results showed that the wear resistance of copper with the nanocrystalline microstructure was enhanced relative to the coarse-grained form. The steady-state friction coefficient of the nc Cu was obviously lower than that of the cg Cu when the load is below 20 N. The wear volume of the nc Cu was always lower than that of the cg Cu for the applied load range from 5 to 40 N. With increase of the load, the difference in wear resistance between the nc and the cg Cu decreased. The enhancement of the wear properties of the nc Cu was associated with the high hardness and the low work-hardening rate of the nanocrystalline structure, and easily being oxidized of wear debris, which was attributed to grain refinement.
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