The Effect of Silver Chloride Formation on the Kinetics of Silver Dissolution in Chloride Solution.

The Effect of Silver Chloride Formation on the Kinetics of Silver Dissolution in Chloride Solution.
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DOI:
10.1016/j.electacta.2010.12.050
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发表时间:
2011-02-28
影响因子:
6.6
通讯作者:
Payer, Joe
Payer, Joe
中科院分区:
材料科学2区
文献类型:
--
作者:
Ha, Hung;Payer, Joe

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The precipitation and growth of AgCl on silver in physiological NaCl solution were investigated. AgCl was found to form at bottom of scratches on the surface which may be the less effective sites for diffusion or the favorable sites for heterogeneous nucleation. Patches of silver chloride expanded laterally on the substrate until a continuous film formed. The ionic transport path through this newly formed continuous film was via spaces between AgCl patches. As the film grew, the spaces between AgCl patches closed and ion transport was primarily via micro-channels running through AgCl patches. The decrease of AgCl layer conductivity during film growth were attributed to the clogging of micro-channels or decrease in charge carrier concentration inside the micro-channels. Under thin AgCl layer, i.e. on the order of a micrometer, the dissolution of silver substrate was under mixed activation-Ohmic control. Under thick AgCl layer, i.e. on the order of tens of micrometers, the dissolution of silver substrate was mediated by the Ohmic resistance of AgCl layer.
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