Preparation and Properties of SiC/Phenolic Resin for the Heat of LED
Preparation and Properties of SiC/Phenolic Resin for the Heat of LED
复制标题
LED散热用SiC/酚醛树脂的制备及性能
DOI：
10.4028/www.scientific.net/msf.848.454
复制
发表时间：
2016-03
期刊：
影响因子：
--
通讯作者：
Jiyuan Ma
中科院分区：
文献类型：
--
作者：
Cong Wu;Kang Zhao;Yufei Tang;Jiyuan Ma
为了解决LED散热用塑料导热系数低的问题，采用粉末冶金法制备了SiC/酚醛树脂LED散热用塑料。研究了纳米粒子的粒径、含量及添加量对复合材料导热性能的影响，并对复合材料的力学性能进行了表征。实验结果表明，所制备的SiC/酚醛树脂绝热性能优于行业标准，导热系数达到4.1W/（m·k）-1。复合材料的弯曲强度达到68.11MPa。材料导热系数低的问题有望得到解决。此外，这对提高LED寿命也很有意义。
In order to solve the problem that low thermal conductivity of the plastics for the heat of LED, SiC/Phenolic resin for the heat of LED were fabricated combining powder metallurgy. The effects of particles diameters, content and adding nanoparticles on thermal conductivity of the fabricated composites were investigated, the mechanical properties were also characterized. The experimental results showed that the materials were obtained, and the insulation performance of the fabricated SiC/Phenolic resin was higher than the industry standard one, the thermal conductivity reached 4.1W/(m·k)-1. And the bending strength of the fabricated composites was up to 68.11MPa. The problem of low thermal conductivity of the material is expected to be solved. In addition, it is meaningful for improving LED life.
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DOI：
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发表时间：
2008
期刊：
Advanced Display
影响因子：
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作者：
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通讯作者：
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作者：
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影响因子：
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2005
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通讯作者：
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DOI：
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发表时间：
2009-09
期刊：
Microelectron. Reliab.
影响因子：
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通讯作者：
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