cDNA cloning of heat shock protein 90 gene and protein expression pattern in response to heavy metal exposure and thermal stress in planarian Dugesia japonica
cDNA cloning of heat shock protein 90 gene and protein expression pattern in response to heavy metal exposure and thermal stress in planarian Dugesia japonica
复制标题
涡虫热休克蛋白 90 基因的 cDNA 克隆及重金属暴露和热应激响应的蛋白表达模式
DOI:
10.1007/s11033-012-1552-9
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发表时间:
2012-03
影响因子:
2.8
通讯作者:
De-Zeng Liu
中科院分区:
文献类型:
--
作者:
Guang-Wen Chen;Ke-Xue Ma;De-Zeng Liu
Heat shock protein 90 (HSP90) is an abundant and highly conserved molecular chaperone, playing important roles in multiple cellular stress responses. The full-length cDNA of planarian Dugesia japonica Hsp90 (designated DjHsp90) was firstly cloned using rapid amplification of cDNA ends (RACE) techniques. It is 2,354 bp, including an open reading frame (ORF) of 2,148 bp encoding a polypeptide of 715 amino acids with all five HSP90 family signatures. We sequenced the ORF sequences from genomic DNA, and found only one intron (48 bp) existed in Djhsp90 gene structure. We used western blot and immunohistochemistry to analyze the expression pattern of DjHsp90 in response to heavy metal exposure and thermal stress at the protein level. Our results show that low doses of heavy metals and elevated culture temperature induced, but high doses of heavy metals and severe heat shock inhibited DjHsp90 expression. In response to heavy metals and thermal stress, DjHsp90-positive cells only appeared in the parenchymal tissue under epidermis cells along the bilateral from head to tail. These positive cells are presumably sensor cells that can detect external environment changes. Our work provides basic data for the study of stress responses in planarians.
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影响因子:
4
作者:
P. Csermely;T. Schnaider;Z. Prohászka;G. Nardai
通讯作者:
P. Csermely;T. Schnaider;Z. Prohászka;G. Nardai
DOI:
10.1002/9781119432401.ch9
发表时间:
2020-02
期刊:
Heat Stress Tolerance in Plants
影响因子:
--
作者:
Annu Yadav;Jitender Singh;K. Ranjan;Pankaj Kumar;Shivani Khanna;Madhuri Gupta;Vinay Kumar;S. H. Wani;Anil Sirohi
通讯作者:
Annu Yadav;Jitender Singh;K. Ranjan;Pankaj Kumar;Shivani Khanna;Madhuri Gupta;Vinay Kumar;S. H. Wani;Anil Sirohi
影响因子:
4.7
作者:
Wenbing Zhang;Chenglong Wu;K. Mai;Qiyong Chen;Wei Xu
通讯作者:
Wenbing Zhang;Chenglong Wu;K. Mai;Qiyong Chen;Wei Xu
DOI:
10.1016/j.cbpb.2005.09.005
发表时间:
2005-12-01
影响因子:
2.2
作者:
Cara, JB;Aluru, N;Vijayan, MM
通讯作者:
Vijayan, MM
影响因子:
4.8
作者:
Ahmed, R;Duncan, RF
通讯作者:
Duncan, RF