Characterizing edge profiles of photomask structures with complementary information from SEM and AFM

Characterizing edge profiles of photomask structures with complementary information from SEM and AFM
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利用 SEM 和 AFM 的补充信息表征光掩模结构的边缘轮廓

DOI:
10.1117/12.2014417
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发表时间:
2013
期刊:
影响因子:
--
通讯作者:
Dorothee Hüser
Dorothee Hüser
中科院分区:
--
文献类型:
--
作者:
Wolfgang Häßler-Grohne;Dorothee Hüser

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对光刻胶掩模上收缩结构的不断增长的精度的需求使得快速、可靠和鲁棒的测试工具成为必要。因此,扫描电子显微镜(SEM)是用于临界尺寸(CD)测量的标准计量工具。采用独立于纳米结构的材料参数的先验知识的算法来确定CD。分析过程中进行了优化,特别是快速扫描和小电流的探测光束测量线结构的光刻掩模。用SEM的边缘表征已经用AFM测量进行了补充。特别是,从AFM形貌信息的高度和斜率估计的边缘过渡的宽度已被比较,从SEM扫描获得。高度和斜率是单向参数,因此它们的确定不需要尖端反褶积。为了描述角点的特征,必须理解卷积过程。因此,原子力显微镜的物理过程的模拟已经进行,以了解力梯度对探针过程的影响,从而导致针尖和样品几何形状的双重卷积,首先是直接的几何形状,其次是由于几何形状的变化而引起的相互作用的变化。从SEM图像估计边缘参数的分析方法对于低至50 nm的线宽稳定工作。已观察到低至± 0.6nm的长期稳定性。
The demand for growing precision of shrinking structures on photolithographic masks makes fast, reliable, and robust testing tools necessary. Scanning electron microscopes (SEM) therefore are standard metrology tools for critical dimension (CD) measurements. An algorithm that is independent of `a priory knowledge of material parameters of the nanostructure is employed to determine CD. The analysis procedure is optimized in particular for fast scanning and small current probing beams to measure line structures on photolithographic masks. The edge characterization with SEM has been complemented with AFM measurements. In particular, the width of the edge transition estimated from height and slope of AFM topography information has been compared to that obtained from SEM scans. Height and slope are unidirectional parameters, so their determination does not need tip deconvolution. To characterize corner roundings the convolution process has to be understood. Therefore, simulations of physical processes of atomic force microscopy have been carried out to understand the influence of force gradients on the probing process causing a double convolution of tip and sample geometry, firstly of the geometries directly and secondly because of the changing interaction due to changing geometries. The analysis method to estimate edge parameters from SEM images works stable for line widths down to 50 nm. A long term stability down to ±0.6 nm has been observed.
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