A novel design of VAlTiCrCu/WC alternate multilayer structure to enhance the mechanical and tribo-corrosion properties of the high-entropy alloy coating
A novel design of VAlTiCrCu/WC alternate multilayer structure to enhance the mechanical and tribo-corrosion properties of the high-entropy alloy coating
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VAlTiCrCu/WC交替多层结构的新颖设计提高了高熵合金涂层的机械和摩擦腐蚀性能
DOI：
10.1016/j.matchar.2021.111115
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发表时间：
2021-04
影响因子：
4.7
通讯作者：
Fan Jun
中科院分区：
文献类型：
--
作者：
Lu Zhaoxia;Mao Yunlei;Ren Siming;Pu Jibin;Fu Zhengyi;Fan Xin;Gao Siqi;Fan Jun
近几十年来，高熵合金（HEA）作为新兴材料引起了全世界研究人员的广泛关注。 VAlTiCrCu涂层具有良好的耐蚀性，但其硬度较低，导致耐磨性较差。在这项工作中，通过磁控溅射制备了新型 VAlTiCrCu/WC 多层涂层。研究了调制周期（17 nm 和 90 nm）对 VAlTiCrCu/WC 多层涂层耐腐蚀性和摩擦学性能的影响。结果表明，VAlTiCrCu/WC多层涂层中的VAlTiCrCu层具有典型的BCC相结构，WC层显着改善了HEA涂层的力学行为。此外，VAlTiCrCu/WC多层膜中的大量界面有效抑制了腐蚀物质向涂层的渗透，提高了摩擦腐蚀性能。与VAlTiCrCu涂层相比，小调制周期（17 nm）的VAlTiCrCu/WC多层涂层具有更好的附着力、更高且更稳定的开路电位（OCP），耐磨性提高近5倍。
In recent decades, high entropy alloys (HEAs) have given rise to much attention of researchers all over the world as emerging materials. VAlTiCrCu coating has good corrosion resistance, but its low hardness results in poor wear resistance. In this work, the novel VAlTiCrCu/WC multilayer coatings were fabricated by magnetron sputtering. The effects of modulation period (17 nm and 90 nm) on the corrosion resistance and tribological properties of the VAlTiCrCu/WC multilayer coatings were investigated. The results show that the VAlTiCrCu layer in the VAlTiCrCu/WC multilayer coatings has a typical BCC phase structure, and the WC layer significantly improves the mechanical behaviors of the HEA coating. In addition, a large number of interfaces in VAlTiCrCu/WC multilayers effectively inhibit the penetration of corrosive species into coatings, improving the tribo-corrosion performance. In comparison to the VAlTiCrCu coating, the VAlTiCrCu/WC multilayer coating with small modulation period (17 nm) has better adhesion, higher and more stable open circuit potential (OCP), and the wear resistance is increased by nearly 5 times.
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影响因子：
5.4
作者：
X. Chu;S. Barnett;M. Wong;W. Sproul
通讯作者：
X. Chu;S. Barnett;M. Wong;W. Sproul
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影响因子：
6.7
作者：
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通讯作者：
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影响因子：
6.7
作者：
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通讯作者：
Du-Cheng Tsai;Yen-Lin Huang;Sheng-Ru Lin;S. Liang;F. Shieu
影响因子：
9.4
作者：
Chuang, Ming-Hao;Tsai, Ming-Hung;Yeh, Jien-Wei
通讯作者：
Yeh, Jien-Wei
影响因子：
8.4
作者：
Zitang Zhang;E. Axinte;W. Ge;Caiyun Shang;Y. Wang
通讯作者：
Zitang Zhang;E. Axinte;W. Ge;Caiyun Shang;Y. Wang