Mechanically Robust Fluorinated Graphene/Poly(p-Phenylene Benzobisoxazole) Nanofiber Films with Low Dielectric Constant and Enhanced Thermal Conductivity: Implications for Thermal Management Applications
Mechanically Robust Fluorinated Graphene/Poly(p-Phenylene Benzobisoxazole) Nanofiber Films with Low Dielectric Constant and Enhanced Thermal Conductivity: Implications for Thermal Management Applications
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具有低介电常数和增强导热性的机械鲁棒性氟化石墨烯/聚（对亚苯基苯并二恶唑）纳米纤维薄膜：对热管理应用的影响
DOI：
10.1021/acsanm.2c04137
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发表时间：
2022-11
影响因子：
5.9
通讯作者：
Bo Zhang
中科院分区：
文献类型：
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作者：
Zihua Yu;Shaohua Wu;Chuncheng Li;Yaonan Xiao;Jiajian Liu;Bo Zhang
低介电材料在微电子领域有着广泛的应用，但其机械性能和导热性较差。在本研究中，我们开发了一类基于氟化石墨烯（FG）的纳米复合薄膜，用三维互联的聚对苯并苯并异恶唑（PBO）纳米纤维网络取代传统的聚合物基体。FG纳米片均匀分布在PBO纳米纤维（PBONF）的多孔网络中，并有序堆叠形成珠状层状结构，铺就有效的热传导路径。最终，FG和PBONF之间强大的界面结合和高效的协同作用赋予复合膜无与伦比的拉伸性能（强度和模量分别高达295.4 MPa和7.79 GPa）和折叠耐久性（1000次折叠后拉伸性能不下降），超低介电常数（低至1.71）和优异的导热系数（12.13 W m-1K-1）。此外，这些FG/PBONF复合薄膜还具有超高的热稳定性（高于540°C时失重5%），这使得它们在极端环境下的高功率电子器件的散热方面具有前景。
Low-dielectric materials have found broad applications in microelectronics but are limited by poor mechanical properties and thermal conductivity. In this study, a class of nanocomposite films based on fluorinated graphene (FG) was developed by replacing the traditional polymer matrix with a 3D interconnected poly(p-phenylene benzobisoxazole) (PBO) nanofiber network. The FG nanosheets are uniformly distributed in the porous network of PBO nanofibers (PBONF) and stacked orderly to form a nacre-like layered structure while paving effective thermal conduction paths. Ultimately, the strong interfacial bonding and efficient synergy between FG and PBONF endow the composite films with unparalleled tensile properties (strength and modulus up to 295.4 MPa and 7.79 GPa, respectively) and folding endurance (no drop in tensile properties after 1000 folds), ultralow dielectric constant (as low as 1.71), and excellent thermal conductivity (12.13 W m–1K–1). In addition, these FG/PBONF composite films also exhibit an ultrahigh thermal stability (5% weight loss temperature higher than 540 °C), which makes them promising for the heat dissipation of high-power electronic devices in extreme environments.
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影响因子：
20.5
作者：
Lei Wang;Zhonglei Ma;Yali Zhang;Huaili Qiu;Kunpeng Ruan;Junwei Gu
通讯作者：
Lei Wang;Zhonglei Ma;Yali Zhang;Huaili Qiu;Kunpeng Ruan;Junwei Gu
影响因子：
41.2
作者：
Evans, Austin M.;Giri, Ashutosh;Hopkins, Patrick E.
通讯作者：
Hopkins, Patrick E.
DOI：
10.1016/j.compositesb.2021.109454
发表时间：
2021-11
期刊：
Composites Part B: Engineering
影响因子：
--
作者：
Lihua Zhao;Lei Wang;Yi-Fei Jin;Junwen Ren;Zhong Wang;Liya Jia
通讯作者：
Lihua Zhao;Lei Wang;Yi-Fei Jin;Junwen Ren;Zhong Wang;Liya Jia
影响因子：
16.1
作者：
He, Jianfeng;Ren, Ming;Li, Qingwen
通讯作者：
Li, Qingwen
影响因子：
19
作者：
Yongzheng Zhang;Kai Wu;Qiang Fu
通讯作者：
Yongzheng Zhang;Kai Wu;Qiang Fu