Preparation of Soft Shape Memory Polymer and Its Application as a Compliant Thermal‐Triggered Gripper
Preparation of Soft Shape Memory Polymer and Its Application as a Compliant Thermal‐Triggered Gripper
复制标题
软形状记忆聚合物的制备及其作为柔性热触发夹具的应用
DOI：
10.1002/macp.201900229
复制
发表时间：
2019-08
影响因子：
2.5
通讯作者：
Xiang Gao
中科院分区：
文献类型：
--
作者：
Hongze Li;Yingwu Luo;Xiang Gao
形状记忆聚合物在其转变温度以上和以下总是经历大的模量变化。冷却至低于其转变温度导致模量急剧增加。这有助于临时形状固定，然而，它也赋予材料不合规的特征，这在某些应用中可能是一个有害因素。在这项工作中，提出了一种方法来制备软的形状记忆聚合物，即使在低温下也具有低模量。这种聚合物的实现取决于通过纳米胶乳共混技术将两种原材料混合。以苯乙烯、甲基丙烯酸酯和丙烯酸正丁酯为模型单体，合成了聚苯乙烯-B-聚（苯乙烯-甲基丙烯酸）-B-聚苯乙烯和聚苯乙烯-B-聚（丙烯酸正丁酯）-B-聚苯乙烯两种三嵌段结构的核壳乳液。以纳米胶乳颗粒为单位共混有助于它们非常均匀地混合并形成共连续形态。通过调整共混比例，制备出20 °C下模量低于50 MPa，同时具有优异形状记忆性能的材料。这种柔软的形状记忆聚合物显示出独特的优势，作为一个顺应性的热触发夹持器来粘贴和放置物体。
A shape memory polymer always experiences a large modulus change above and below its transition temperature. Cooling down below its transition temperature leads to a sharp modulus increase. That helps the temporary shape fixing, however, it also gives the material noncompliant character, which may be a harmful factor in some applications. In this work, an approach is proposed to prepare a soft shape memory polymer with low modulus even at low temperature. The realization of this polymer depends on the mixing of two raw materials through nano‐latex blending technique. By using styrene, meth acrylate, and n‐butyl acrylate as model monomer, two kinds of core–shell latexes are synthesized, which have a triblock structure as polystyrene‐b‐poly (styrene‐co‐meth acrylate)‐b‐polystyrene and polystyrene‐b‐poly (n‐butyl acrylate)‐b‐polystyrene, respectively. Blending in the unit of nano‐latex particle helps them mixing very homogenously and forms co‐continuous morphology. The blending ratio is tuned to prepare materials with modulus lower than 50 MPa at 20 °C, meanwhile with excellent shape memory performance. Such a soft shape memory polymer shows unique advantage as a compliant thermal‐triggered gripper to stick and place objects.
登录
查看更多内容
影响因子：
5.5
作者：
Bin Zhao;W. Brittain;Wensheng Zhou;Stephen Z. D. Cheng
通讯作者：
Bin Zhao;W. Brittain;Wensheng Zhou;Stephen Z. D. Cheng
DOI：
10.1098/rsta.2009.0005
发表时间：
2009-04
期刊：
Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences
影响因子：
--
作者：
E. Johnson;R. Bonser;G. Jeronimidis
通讯作者：
E. Johnson;R. Bonser;G. Jeronimidis
影响因子：
4.6
作者：
Heng Zhang;Haitao Wang;W. Zhong;Q. Du
通讯作者：
Heng Zhang;Haitao Wang;W. Zhong;Q. Du
影响因子：
2.4
作者：
Y. Godovsky;N. P. Bessonova;N. N. Mironova-N.
通讯作者：
Y. Godovsky;N. P. Bessonova;N. N. Mironova-N.
影响因子：
5.5
作者：
Weiming Tang;W. Macknight;S. Hsu
通讯作者：
Weiming Tang;W. Macknight;S. Hsu