Solution-based, additive fabrication of flush metal conductors in plastic substrates by printing and plating in two-level capillary channels
Solution-based, additive fabrication of flush metal conductors in plastic substrates by printing and plating in two-level capillary channels
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通过在两级毛细管通道中印刷和电镀，基于解决方案的增材制造塑料基材中的齐平金属导体
DOI：
10.1088/2058-8585/ac298a
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发表时间：
2021
影响因子：
3.1
通讯作者：
Francis, Lorraine F
中科院分区：
文献类型：
--
作者：
Jochem, Krystopher S;Kolliopoulos, Panayiotis;Frisbie, C Daniel;Francis, Lorraine F
针对印刷电子器件和互连线中的应用，提出了一种控制受限特征中化学镀铜沉积结构的策略。这项工作建立在并完善了先前使用组合压印，印刷和印版策略增材制造金属导体的过程。设计了一种两级压印通道几何结构，该几何结构由内部平行毛细管通道组成，该毛细管通道沿着主通道的基底表面运行，以控制无电铜沉积。内部毛细管通道包含并精确定位银油墨种子层，并且主通道在无电镀铜从种子层沉积时限制无电镀铜，从而产生与基板表面齐平或处于受控深度的平坦铜表面。该工艺生产的金属导体的纵横比（高度/宽度）高达1002和低边缘粗糙度，如压印工艺所定义的。最终导体的电阻随长度线性变化，并与主通道的宽度成反比，这表明整个系统具有高均匀性。宽度为40 μm、深度为10 μm的导线具有低的单位长度电阻（101 Ω cm− 1），并在反复机械弯曲下保持其性能。这里描述的用于限制无电镀铜的生长的方法适于形成用于柔性电子器件中的许多应用的导体。
A strategy to control the structure of electroless copper deposition in confined features was developed for applications in printed electronic devices and interconnects. This work builds on and refines a previous process of additively manufacturing metal conductors using a combined imprint, print, and plate strategy. A two-level imprinted channel geometry, consisting of inner, parallel capillary channels running along the base surface of a main channel, was designed to control electroless copper deposition. The inner capillary channels contain and precisely position the silver ink seed layer, and the main channel confines the electroless copper as it deposits from the seed layer, resulting in flat copper surfaces that are flush with the surface of the substrate or at a controlled depth. This process produces metal conductors with aspect ratios (height/width) up to≈ 2 and low edge roughnesses as defined by the imprinting process. The resistance of the final conductors varies linearly with the length and inversely with the width of the main channel, suggesting high uniformity throughout. Conductive lines with a width of 40 μm and depth of 10 µm had low resistance per unit length (≈ 1Ω cm− 1) and retained their performance with repeated mechanical flexing. The methods described here to confine the growth of electroless plated copper are adaptable to form conductors for numerous applications in flexible electronics.
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影响因子：
4.2
作者：
Jochem, Krystopher S.;Suszynski, Wieslaw J.;Francis, Lorraine F.
通讯作者：
Francis, Lorraine F.
高深宽比四分之一微米化学镀铜集成技术
DOI：
--
发表时间：
1997
期刊：
European Workshop Materials for Advanced Metallization
影响因子：
--
作者：
Y. Shacham;S. Lopatin
通讯作者：
S. Lopatin
影响因子：
3.1
作者：
W. J. Hyun;E. Secor;Fazel Zare Bidoky;S. B. Walker;J. Lewis;M. Hersam;L. Francis;C. Frisbie
通讯作者：
W. J. Hyun;E. Secor;Fazel Zare Bidoky;S. B. Walker;J. Lewis;M. Hersam;L. Francis;C. Frisbie
化学镀铜醋酸钯薄膜的 VUV 光诱导分解
DOI：
--
发表时间：
1997
期刊：
影响因子：
--
作者：
Jun;S. King;I. Boyd;Q. Fang
通讯作者：
Q. Fang
影响因子：
3.1
作者：
Cao, Motao;Hyun, Woo Jin;Frisbie, C. Daniel
通讯作者：
Frisbie, C. Daniel