Direct Writing of Cu Patterns on Polydimethylsiloxane Substrates Using Femtosecond Laser Pulse-Induced Reduction of Glyoxylic Acid Copper Complex.
Direct Writing of Cu Patterns on Polydimethylsiloxane Substrates Using Femtosecond Laser Pulse-Induced Reduction of Glyoxylic Acid Copper Complex.
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利用飞秒激光脉冲诱导还原乙醛酸铜配合物在聚二甲基硅氧烷基底上直接写入铜图案。
DOI：
10.3390/mi12050493
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发表时间：
2021-04-27
期刊：
影响因子：
3.4
通讯作者：
Mizoshiri M
中科院分区：
文献类型：
--
作者：
Ha NP;Ohishi T;Mizoshiri M
利用飞秒激光脉冲诱导热化学还原乙醛酸铜（GACu）配合物，研究了铜（Cu）图案在玻璃和聚二甲基硅氧烷（PDMS）衬底上的直接写入性能。利用低数值孔径0.45的聚焦飞秒激光脉冲照射涂覆在基片上的GACu配合物薄膜。在相同的激光扫描速度和脉冲能量条件下，在PDMS衬底上制作的线条图案宽度大于在玻璃衬底上制作的线条图案宽度。玻璃衬底上图案的x射线衍射峰与Cu相对应，没有明显的氧化。相比之下，虽然在扫描速度为10 mm/s、脉冲能量为0.49 nJ的条件下可以在PDMS衬底上生成Cu图案，但在扫描速度为1 mm/s、脉冲能量为0.37 nJ的过热条件下也可以生成Cu2O。所有的图案都表现出导电性。PDMS衬底上的最小电阻率为1.4 × 10−5 Ωm，是玻璃衬底上的10倍，说明激光照射时衬底热收缩形成的微裂纹增加了电阻率。这种在软质材料上直接刻写铜的技术对于柔性微器件的制造是非常有用的。
We investigate the direct writing properties of copper (Cu) patterns on glass and polydimethylsiloxane (PDMS) substrates using femtosecond laser pulse-induced thermochemical reduction of glyoxylic acid copper (GACu) complex. The films of the GACu complex coated on the substrates were irradiated by focused femtosecond laser pulses using a low numerical aperture of 0.45. Under the same conditions, such as laser scanning speed and pulse energy, the width of the line patterns fabricated on PDMS substrates was larger than that on glass substrates. X-ray diffraction peaks of the patterns on glass substrates corresponded to Cu without significant oxidation. By contrast, although Cu patterns were fabricated on PDMS substrates at a scanning speed of 10 mm/s and pulse energy of 0.49 nJ, Cu2O was also generated under overheating conditions at a scanning speed of 1 mm/s and pulse energy of 0.37 nJ. All the patterns exhibited electrical conductivity. The minimum resistivity of the patterns on PDMS substrates is 1.4 × 10−5 Ωm, which is 10 times higher than that on glass substrates, indicating that microcracks formed by thermal shrinkage of the substrates during the laser irradiation increase the resistivity. This direct Cu writing technique on soft materials is useful for fabricating flexible microdevices.
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影响因子：
6.7
作者：
Lee, Jeonghyeon;Lee, Byoungyoon;Lee, Myeongkyu
通讯作者：
Lee, Myeongkyu
影响因子：
2.3
作者：
Mizoshiri, Mizue;Arakane, Shun;Hata, Seiichi
通讯作者：
Hata, Seiichi
影响因子：
17.1
作者：
Lee, Daeho;Paeng, Dongwoo;Grigoropoulos, Costas P.
通讯作者：
Grigoropoulos, Costas P.
DOI：
10.1007/s00339-017-1489-x
发表时间：
2018-01-01
影响因子：
2.7
作者：
Mizoshiri, Mizue;Hata, Seiichi
通讯作者：
Hata, Seiichi
影响因子：
3.4
作者：
Mizoshiri, Mizue;Aoyama, Keiko;Ohishi, Tomoji
通讯作者：
Ohishi, Tomoji