Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications
Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications
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接近卷对卷流体自组装：相关参数、机器设计和应用
DOI：
10.1109/jmems.2015.2452772
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发表时间：
2015
影响因子：
2.7
通讯作者：
Heiko O. Jacobs
中科院分区：
文献类型：
--
作者：
Se-Chul Park;Jun Fang;Shantonu Biswas;Mahsa Mozafari;Thomas Stauden;Heiko O. Jacobs
本文介绍了一种基于表面张力驱动自组装的卷对卷自动化流体自组装系统的实现及其在宏电子学领域的应用。所报道的系统包括自动搅拌、幅材运动、组分分配和回收。该工艺使得能够在大面积衬底上以连续和并行的方式组装和电连接半导体管芯/芯片。目前，该方法实现了每小时15000个芯片的组装速率和超过99%的组装成品率，测试了300-1000 μm尺寸的标准方形模具的组装。由于自组装的并行方式，可以将系统缩放到任何期望的吞吐量。工艺参数和力之间的关系的识别和建模进行了研究和实验验证，通过测试的效果的网络角度，搅拌组件，和分离速率。作为一个应用程序，我们演示了一个固态照明模块的实现。该特定应用需要导电多层夹层结构的组装，这通过将所介绍的组装工艺与新颖的层压步骤相结合来实现。
This paper presents the implementation of an automated roll-to-roll fluidic self-assembly system based on the surface tension driven self-assembly with applications in the field of macroelectronics. The reported system incorporates automated agitation, web motion, component dispensing, and recycling. The process enables the assembly and electrical connection of semiconductor dies/chips in a continuous and parallel fashion over wide area substrates. At present, the method achieves an assembly rate of 15000 chips per hour and an assembly yield exceeding 99%, testing assembly of standard square-shaped dies, 300-1000 μm size. Scaling the system to any desired throughput is possible due to the parallel manner of selfassembly. The identification and the modeling of the relationship between process parameters and forces have been studied and experimentally verified by testing the effect of the web angle, agitation on assembly, and detachment rates. As an application, we demonstrate the realization of a solid-state lighting module. This particular application requires the assembly of a conductive multilayer sandwich structure, which is achieved by combining the introduced assembly process with a novel lamination step.
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影响因子：
4.9
作者：
Kim, Dae-Hyeong;Ahn, Jong-Hyun;Rogers, John A.
通讯作者：
Rogers, John A.
影响因子：
3.9
作者：
Laskovski, D.;Stevenson, P.;Galvin, K. P.
通讯作者：
Galvin, K. P.
影响因子：
29.4
作者：
Park, Se-Chul;Fang, Jun;Biswas, Shantonu;Mozafari, Mahsa;Stauden, Thomas;Jacobs, Heiko O.
通讯作者：
Jacobs, Heiko O.
影响因子：
3.1
作者：
Crawford, GP
通讯作者：
Crawford, GP