A first implementation of an automated reel-to-reel fluidic self-assembly machine.
A first implementation of an automated reel-to-reel fluidic self-assembly machine.
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DOI：
10.1002/adma.201401573
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发表时间：
2014-09-10
影响因子：
29.4
通讯作者：
Jacobs, Heiko O.
中科院分区：
文献类型：
--
作者：
Park, Se-Chul;Fang, Jun;Biswas, Shantonu;Mozafari, Mahsa;Stauden, Thomas;Jacobs, Heiko O.
模板定向自组装领域继续快速发展。然而，当涉及到半导体芯片/小芯片的成品率和组装时，只有两种已知的方法可以接近100%的组装成品率。第一种方法使用重力与互补的3D形状相结合来将梯形硅芯片组装到塑料基板上。第二种方法使用重力与表面张力定向自组装相结合，或者使用亲水/疏水表面图案[23-25]，或者使用焊料图案表面以类似的成品率在表面上组装和电连接半导体芯片/芯片。[7-9，16，27，36]在所有已发表的方法中，首先引用在[22]中的方法仍然是唯一被规模化以用于工业制造过程的方法；然而，这种“自组装机器”的蓝图从未被披露过。不幸的是，所有发表的报告都描述了小面积上的组装，通常不到1平方厘米，并且是小而不连续的批次，比如需要手动搅拌和有经验的科学家进行的自组装实验。扩大到大面积似乎是一个“难题”，因为低垂的果实较少，但研究界似乎绝对有必要展示最初的蓝图，以帮助技术适应。在这篇通讯中，我们报告了第一次实现基于表面张力定向自组装的自组装机的最新进展。报道的组装过程不再是不连续的小批量手工操作过程，而是类似于自动化机器过程，涉及传送带和具有自动搅拌的卷轴到卷轴(RTR)类型的组装方法。作为比较，传统芯片级拾取贴片机的装配率取决于系统的成本和所使用的装配头的数量。例如，一个高端FCM 10000(Muehlbauer AG)倒装芯片组装系统可以每小时组装大约8,000个芯片，实现30微米的贴装精度。我们目前的设计使用2.5厘米宽的组装区域实现了每小时15k芯片，这仅比较快的拾取贴装机高出2倍；然而，使用25厘米宽的卷筒纸可以扩展到每小时150k芯片，这将是快20倍。原则上，考虑到自组装的并行性质，扩展到任何吞吐量都应该是可能的。在贴装精度方面，我们的精度随着芯片和焊料凸起尺寸的减小而提高。[9]一般来说，它超过了已使用的元件的30微米限制。在优化的操作条件下，采用自组装工艺实现了99.8%的组装产率。作为应用，该装配机被应用于实现包含分布式无机发光二极管(LED)的区域照明面板。
The field of template directed self-assembly continues to grow rapidly. However, when it comes to yield and assembly of semiconductor dies/chiplets only two methods are known to approach assembly yields of 100%. The first method uses gravity in combination with complementary 3D shapes to assemble trapezoidal Si dies onto plastic substrates.[20–22] The second uses gravity in combination with surface-tension-directed-self-assembly either using hydrophilic/hydrophobic surface patterns [23–25] or using solder-patterned surfaces to assemble and electrically connect semiconductor dies/chiplets on surfaces with similar yields.[7–9, 16, 27, 36] Among all the methods that have been published the method first referenced in [22] remains the only method that has been scaled to be used in an industrial manufacturing process; the blueprints of the “self-assembly machine”, however, has never been disclosed. Unfortunately, all published reports describe assemblies over small areas typically less than 1 cm 2 and in small discontinuous batch like self-assembly experiments involving manual agitation and an experienced scientist. Scaling to large areas appears to be a “hard problem” where there are fewer low hanging fruits, yet it appears absolutely necessary for the research community to demonstrate first blueprints to aid technology adaptation. In this communication, we report on recent progress towards a first implementation of a self-assembly machine that is based on surface-tension-directed-self-assembly. The reported assembly process is no longer a discontinuous small-batch hand-operated process but resembles an automated machine like process involving a conveyer belt and a reel-to-reel (RTR) type assembly approach with automated agitation. As a comparison, the assembly rate of conventional chip level pick-andplace machines depends on the cost of the system and number of assembly heads that are used. For example, a high-end FCM 10000 (Muehlbauer AG) flip chip assembly system can assemble approximately 8000 chips per hour achieving a placement accuracy of 30 µm. Our current design achieves 15 k chips per hour using a 2.5 cm wide assembly region which is only a factor of 2 better than one of the faster pick-and-place machines; scaling to 150 k chips per hour, however, would be possible using a 25 cm wide web, which would be a factor of 20 faster. In principle, scaling to any throughput should be possible considering the parallel nature of self-assembly. In terms of placement accuracy our precision increase with a reduction of chip and solder bump size.[9] Generally, it exceeds the 30 µm limits for the components that have been used. Under optimized operational conditions, we achieved an assembly yield of 99.8% using the selfassembly process. As an application the assembly machine is applied to the realization of area lighting panels incorporating distributed inorganic light emitting diodes (LEDs).
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影响因子：
29.4
作者：
Cole, Jesse J.;Wang, Xinyu;Jacobs, Heiko O.
通讯作者：
Jacobs, Heiko O.
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Loo, YL;Willett, RL;Rogers, JA
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Rogers, JA
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Jacobs, Heiko O.
影响因子：
56.9
作者：
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通讯作者：
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