Biorecognition by DNA oligonucleotides after exposure to photoresists and resist removers.
Biorecognition by DNA oligonucleotides after exposure to photoresists and resist removers.
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DOI：
10.1021/la402362u
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发表时间：
2013-09-10
期刊：
影响因子：
--
通讯作者：
Keating CD
中科院分区：
文献类型：
--
作者：
Dean SL;Morrow TJ;Patrick S;Li M;Clawson GA;Mayer TS;Keating CD
将生物分子与集成电路技术相结合对于下一代传感器和生物医学设备具有相当大的兴趣。然而，目前的光刻微制造方法是为了与硅技术而不是生物有机分子兼容而开发的，因此不能假设生物分子在芯片处理期间保持附着和完整。在这里，我们评估了三种常见的光致抗蚀剂（Microphase S1800系列，PMGI SF6和Megaphase SPR 3012）和两种光致抗蚀剂去除剂（丙酮和1165去除剂）的表面固定的DNA寡核苷酸的能力，选择性地识别其反向互补序列的影响。比较了两种常见的DNA固定方法：直接将5′-巯基化序列吸附在金纳米线上和将5′-巯基化序列共价连接在二氧化硅包覆的纳米线表面胺上。我们发现，与1165去除剂相比，丙酮对选择性杂交具有有害影响，这可能是由于不完全的抗蚀剂去除。使用PMGI光致抗蚀剂，其涉及高温烘烤步骤，对随后的杂交测定中与光致抗蚀剂结合的DNA的性能是有害的，特别是对于通过硫醇吸附附着的DNA。其他三种光致抗蚀剂基本上没有降低DNA结合能力或对互补DNA序列的选择性。为了确定光刻步骤是否引起更细微的损伤，我们还测试了含有单个碱基错配的寡核苷酸。最后，一个两步的电沉积过程中开发和使用的介电泳纳米线组件的组合，以产生一个阵列的双接触，电隔离的芯片上的各个纳米线组件。制造后的荧光成像表明，存在与DNA结合的DNA，并且能够选择性地结合互补链。
Combining biological molecules with integrated circuit technology is of considerable interest for next generation sensors and biomedical devices. Current lithographic microfabrication methods, however, were developed for compatibility with silicon technology rather than bioorganic molecules and consequently it cannot be assumed that biomolecules will remain attached and intact during on-chip processing. Here, we evaluate the effects of three common photoresists (Microposit S1800 series, PMGI SF6, and Megaposit SPR 3012) and two photoresist removers (acetone and 1165 remover) on the ability of surface-immobilized DNA oligonucleotides to selectively recognize their reverse-complementary sequence. Two common DNA immobilization methods were compared: adsorption of 5′-thiolated sequences directly to gold nanowires and covalent attachment of 5′-thiolated sequences to surface amines on silica coated nanowires. We found that acetone had deleterious effects on selective hybridization as compared to 1165 remover, presumably due to incomplete resist removal. Use of the PMGI photoresist, which involves a high temperature bake step, was detrimental to the later performance of nanowire-bound DNA in hybridization assays, especially for DNA attached via thiol adsorption. The other three photoresists did not substantially degrade DNA binding capacity or selectivity for complementary DNA sequences. To determine if the lithographic steps caused more subtle damage, we also tested oligonucleotides containing a single base mismatch. Finally, a two-step photolithographic process was developed and used in combination with dielectrophoretic nanowire assembly to produce an array of doubly-contacted, electrically isolated individual nanowire components on a chip. Post-fabrication fluorescence imaging indicated that nanowire-bound DNA was present and able to selectively bind complementary strands.
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DOI：
10.1126/science.1165921
发表时间：
2009-01-16
期刊：
Science (New York, N.Y.)
影响因子：
--
作者：
Morrow TJ;Li M;Kim J;Mayer TS;Keating CD
通讯作者：
Keating CD
影响因子：
4.2
作者：
Mitsakakis, Konstantinos;Sekula-Neuner, Sylwia;Gizeli, Electra
通讯作者：
Gizeli, Electra
影响因子：
--
作者：
Hulteen, JC;Martin, CR
通讯作者：
Martin, CR
影响因子：
2.3
作者：
Diakoumakos, CD;Douvas, A;Argitis, P
通讯作者：
Argitis, P
影响因子：
2.9
作者：
Crespo-Hernández, CE;Arce, R;Close, DM
通讯作者：
Close, DM