Influence of Substrate Negative Bias on Structure and Properties of TiN Coatings Prepared by Hybrid HIPIMS Method
Influence of Substrate Negative Bias on Structure and Properties of TiN Coatings Prepared by Hybrid HIPIMS Method
复制标题
基体负偏压对混合HIPIMS法制备TiN涂层结构和性能的影响
DOI：
10.1016/j.jmst.2014.06.002
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发表时间：
2015
影响因子：
10.9
通讯作者：
Wang Aiying
中科院分区：
文献类型：
--
作者：
Wang Zhenyu;Zhang Dong;Ke Peiling;Liu Xincai;Wang Aiying
采用自制的高功率脉冲磁控溅射（HIPIMS）混合溅射技术在室温下沉积TiN涂层。研究了衬底负偏压对沉积速率、成分、晶体结构、表面形貌、显微组织和力学性能的影响。结果表明：随着偏置电压从−50到−400 V的增加，TiN涂层呈现致密化趋势，晶体结构逐渐由（111）取向向（200）取向演变；随着涂层致密化，生长速率从12.2 nm / min下降到7.8 nm / min。当偏置电压为−300 V时，TiN涂层的表面粗糙度最小值为10.1 nm，硬度和杨氏模量分别达到最大值17.4 GPa和263.8 GPa。同时，涂层与基体之间的结合力最高。
TiN coatings were deposited using a hybrid home-made high power impulse magnetron sputtering (HIPIMS) technique at room temperature. The effects of substrate negative bias voltage on the deposition rate, composition, crystal structure, surface morphology, microstructure and mechanical properties were investigated. The results revealed that with the increase in bias voltage from −50 to −400 V, TiN coatings exhibited a trend of densification and the crystal structure gradually evolved from (111) orientation to (200) orientation. The growth rate decreased from about 12.2 nm to 7.8 nm per minute with the coating densification. When the bias voltage was −300 V, the minimum surface roughness value of 10.1 nm was obtained, and the hardness and Young's modulus of TiN coatings reached the maximum value of 17.4 GPa and 263.8 GPa, respectively. Meanwhile, the highest adhesion of 59 N was obtained between coating and substrate.
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影响因子：
2.1
作者：
PELLEG, J;ZEVIN, LZ;CROITORU, N
通讯作者：
CROITORU, N
影响因子：
4.7
作者：
V. Uvarov;I. Popov
通讯作者：
V. Uvarov;I. Popov
影响因子：
2.1
作者：
A. Perry
通讯作者：
A. Perry
DOI：
10.1016/j.msea.2005.09.132
发表时间：
2006-05
影响因子：
6.4
作者：
R. Chandra;D. Kaur;A. Chawla;N. Phinichka;Z. Barber
通讯作者：
R. Chandra;D. Kaur;A. Chawla;N. Phinichka;Z. Barber
影响因子：
5.4
作者：
Ma, L. W.;Cairney, J. M.;Munroe, P. R.
通讯作者：
Munroe, P. R.