Flash light assisted additive manufacturing of 3D structural electronics (FLAME)
Flash light assisted additive manufacturing of 3D structural electronics (FLAME)
复制标题
闪光灯辅助 3D 结构电子增材制造 (FLAME)
DOI：
10.1016/j.jmapro.2022.08.003
复制
发表时间：
2022
影响因子：
6.2
通讯作者：
Malhotra, Rajiv
中科院分区：
文献类型：
--
作者：
Jahangir, Md Naim;Cleeman, Jeremy;Pan, Changqin;Chang, Chih-Hung;Malhotra, Rajiv
3D电路与3D打印聚合物部件内的现成电子设备的增材集成，即，结构电子学，可以在小型化的多功能结构中实现新的范例。本文研究了一种称为闪光辅助制造结构电子（FLAME）的混合印刷工艺，该工艺将聚合物的熔丝制造（FFF）与银纳米颗粒的印刷和强脉冲光烧结（IPL）相结合。IPL参数和纳米颗粒形状对电导率的影响是量化的，揭示了使用纳米线与IPL允许更大的电导率与较少的烧结引起的聚合物损伤。在过FFF期间表征平面电路的导电性，即，在烧结电路上的聚合物的FFF期间。一个意想不到的发现是，over-FFF以复杂和非单调的方式增加电导率，这取决于over-FFF参数。介绍了一种多层强脉冲光（IPL）策略，用于穿通平面电路，其中纳米线以小于电路总高度的增量沉积，并且在每次增量之后执行IPL。电磁和热模拟揭示了为什么贯通平面电路的导电性低于平面电路，并揭示了多层IPL在提高贯通平面电路导电性方面的关键作用。总的来说，与现有技术的基于纳米颗粒印刷的方法相比，FLAME使平面电路的导电率增加了300%，使贯通平面电路的导电率增加了170%，即使对于低热容限聚合物，每个聚合物层的导电率也小于10 s。这些进展打破了困扰现有的基于纳米颗粒的打印方法用于制造3D结构电子器件的性能-材料-吞吐量权衡。
Additive integration of 3D electrical circuits with off-the-shelf electronic devices inside 3D printed polymer parts, i.e., structural electronics, can enable new paradigms in miniaturized multifunctional structures. This paper investigates a hybrid printing process called Flash Light Assisted Manufacturing of structural Electronics (FLAME) which integrates Fused Filament Fabrication (FFF) of polymers with printing and Intense Pulsed Light sintering (IPL) of silver nanoparticles. The effect of IPL parameters and nanoparticle shape on conductivity is quantified, revealing that using NWs with IPL allows greater conductivity with lesser sintering-induced polymer damage. The conductivity of planar circuits is characterized during over-FFF, i.e., during FFF of the polymer on the sintered circuit. An unexpected finding is that over-FFF increases the conductivity in a complex and non-monotonic manner that depends on the over-FFF parameters. A multi-layer IPL strategy is introduced for through-plane circuits, in which NWs are deposited in increments smaller than the circuit's total height and IPL is performed after each increment. Electromagnetic and thermal simulations reveal why through-plane circuits have lesser conductivity than planar ones and uncover the key role of multi-layer IPL in increasing the conductivity of through-plane circuits. Overall, FLAME increases the conductivity by 300 % for planar circuits and by 170 % for through-plane circuits as compared to state-of-the-art nanoparticle printing-based methods, even for low-thermal-tolerance polymers, in less than 10 s for each polymer layer. These advances break the performance-material-throughput tradeoff that plagues existing nanoparticle-based printing methods for fabricating 3D structural electronics.
登录
查看更多内容
影响因子：
13.6
作者：
Yang, Yang;Li, Xiangjia;Chen, Yong
通讯作者：
Chen, Yong
影响因子：
3.5
作者：
Bansal, S.;Malhotra, R.
通讯作者：
Malhotra, R.
影响因子：
4.6
作者：
MacNeill W;Choi CH;Chang CH;Malhotra R
通讯作者：
Malhotra R
提高射频 3D 打印导电浆料的导电性
DOI：
10.1109/imws-amp.2018.8457162
发表时间：
2018
期刊：
2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
影响因子：
--
作者：
S. Hawasli;H. Tsang;N. Lazarus;G. Smith;E. Forsythe
通讯作者：
E. Forsythe
影响因子：
11
作者：
Flowers, Patrick F.;Reyes, Christopher;Wiley, Benjamin J.
通讯作者：
Wiley, Benjamin J.