Evaluation of residual stress in InP and InAs (100) substrates obtained from single crystals grown by LEC and VGF methods

Evaluation of residual stress in InP and InAs (100) substrates obtained from single crystals grown by LEC and VGF methods
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通过 LEC 和 VGF 方法生长的单晶获得的 InP 和 InAs (100) 衬底中残余应力的评估

DOI:
10.1016/j.mssp.2020.105460
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发表时间:
2021
影响因子:
4.1
通讯作者:
Lijie Liu
Lijie Liu
中科院分区:
工程技术3区
文献类型:
--
作者:
Yuan Zhou;Youwen Zhao;Guiying Shen;Hui Xie;Jingming Liu;Jun Yang;Lijie Liu

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用拉曼光谱研究了液封提拉法(LEC)和垂直温度梯度冻结法(VGF)生长的未掺杂InP和InAs单晶切片上的残余应力分布。VGF-InP和VGF-InAs晶片的残余应力都比它们的LEC晶片大,但分布均匀。LEC法和VGF法生长的晶片的残余应力与拉曼峰的半高宽呈反分布关系。平坦度结果表明,与LEC生长的晶片相比,VGF生长的晶片一般具有更好的平坦度参数,但具有更高的残余应力。
Raman spectroscopy has been used to characterize and compare residual stress distribution across wafers sliced from un-doped InP and InAs single crystals grown by liquid encapsulated Czochralski (LEC) and vertical temperature gradient freezing (VGF) methods, respectively. Both VGF-InP and VGF-InAs wafers exhibit greater residual stress but even distribution across the wafer than their LEC wafers. There is an inverse distribution correlation between the residual stress and the Full width at half maximum (FWHM) of Raman peak for the wafer grown by LEC or VGF method. The flatness results suggest that VGF-grown wafers generally have better flatness parameters but with higher residual stress than LEC-grown wafers.
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